Abstract
Micro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used in miniaturized low power and low mass smart structures in medicine, biology and space applications. Recently similar features found their way inside high energy physics with applications in vertex detectors for high-luminosity LHC Upgrades, with 3D sensors, 3D integration and efficient power management using silicon micro-channel cooling. This paper reports on the state of this development.
| Original language | English |
|---|---|
| Pages (from-to) | 151-154 |
| Number of pages | 4 |
| Journal | Nuclear Inst. and Methods in Physics Research, A |
| Volume | 765 |
| DOIs | |
| State | Published - Nov 21 2014 |
Keywords
- 3D integration
- 3D printing
- 3D silicon sensor
- ATLAS pixel upgrade
- FE-I4
- LHC upgrade
- MEMS
- Pixels
- Radiation hardness. Micro-channel-cooling
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