Abstract
3D silicon technology is a new way to make silicon detectors using Micro-Electro-Mechanical-Systems (MEMS) processing. In this innovative design the electrodes penetrate through the silicon bulk perpendicular to the surface. Two types of device have been developed - 3D and planar 3D. Both use an edge electrode that eliminates the need for guard rings and provides sensitivity to within a few microns of the edge. 3D technology and its advantages are reviewed and examples of the two types of device are shown.
| Original language | English |
|---|---|
| Pages (from-to) | 122-125 |
| Number of pages | 4 |
| Journal | Nuclear Inst. and Methods in Physics Research, A |
| Volume | 549 |
| Issue number | 1-3 |
| DOIs | |
| State | Published - Sep 1 2005 |
| Event | VERTEX 2003 - Duration: Sep 14 2003 → Sep 19 2003 |
Keywords
- 3D detector
- Active edge
- Planar 3D
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