Abstract
The Timespot1 ASIC was developed using 28-nm CMOS technology within the TimeSPOT/IGNITE collaborations and aimed to bridge the gap between available fast-timing ASICs and those required for high-luminosity applications. We present results of the performance of the Timespot1 hybrid, where 3D trench silicon and 3D columnar diamond sensors have been bump-bonded to the Timespot1 ASIC.
| Original language | English |
|---|---|
| Article number | 169796 |
| Journal | Nuclear Inst. and Methods in Physics Research, A |
| Volume | 1068 |
| DOIs | |
| State | Published - Nov 2024 |
Keywords
- 3D silicon sensors
- Fast-timing electronics
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