TY - GEN
T1 - A fully differential CMOS capacitance sensor design, testing and array architecture
AU - Prakash, Somashekar Bangalore
AU - Abshire, Pamela
PY - 2008
Y1 - 2008
N2 - The paper presents a fully differential capacitance sensor employing the CBCM technique to map differential input capacitances to rail-to-rail differential output voltages. The circuit has been designed for measuring capacitances in the ±20 fF range, appropriate for sensing live cells using on-chip microelectrodes. The paper also proposes an array architecture based on a shielded current routing bus that allows for a single measurement circuit to be shared by all the sensor pixels without compromising performance. This eliminates the need for individual pixel calibration. Each sensor pixel comprises 6 minimum size digital transistors, enabling high density integration. The sensor employs a 3-phase clocking scheme that enables gain tuning and also limits output voltage offsets. The paper presents data obtained from 5 chips fabricated in a commercially available 2-poly, 3-metal, 0.5 μm CMOS technology, each of them comprising individual circuits measuring the substrate-coupling capacitances of metal3 electrodes of varying sizes. The test data indicates successful sensor operation with a maximum sensitivity of 126 mV/fF, a maximum achievable resolution of 14 aF and an output dynamic range of 69.4 dB.
AB - The paper presents a fully differential capacitance sensor employing the CBCM technique to map differential input capacitances to rail-to-rail differential output voltages. The circuit has been designed for measuring capacitances in the ±20 fF range, appropriate for sensing live cells using on-chip microelectrodes. The paper also proposes an array architecture based on a shielded current routing bus that allows for a single measurement circuit to be shared by all the sensor pixels without compromising performance. This eliminates the need for individual pixel calibration. Each sensor pixel comprises 6 minimum size digital transistors, enabling high density integration. The sensor employs a 3-phase clocking scheme that enables gain tuning and also limits output voltage offsets. The paper presents data obtained from 5 chips fabricated in a commercially available 2-poly, 3-metal, 0.5 μm CMOS technology, each of them comprising individual circuits measuring the substrate-coupling capacitances of metal3 electrodes of varying sizes. The test data indicates successful sensor operation with a maximum sensitivity of 126 mV/fF, a maximum achievable resolution of 14 aF and an output dynamic range of 69.4 dB.
UR - https://www.scopus.com/pages/publications/51749102440
U2 - 10.1109/ISCAS.2008.4541380
DO - 10.1109/ISCAS.2008.4541380
M3 - Conference contribution
AN - SCOPUS:51749102440
SN - 9781424416844
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 165
EP - 168
BT - 2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008
T2 - 2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008
Y2 - 18 May 2008 through 21 May 2008
ER -