A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module

Riya Paul; Asif Faruque; Ayesha Hassan; H. Alan Mantooth; Sama Salehi Vala; Abdul Basit Mirza; Fang Luo

doi:10.1109/NEWCAS52662.2022.9842249

A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module

Riya Paul
, Asif Faruque
, Ayesha Hassan
, H. Alan Mantooth
, Sama Salehi Vala
, Abdul Basit Mirza
, Fang Luo

Electrical Engineering

University of Arkansas, Fayetteville
Stony Brook University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Scopus citations

Abstract

A novel half-bridge silicon carbide (SiC) double-sided cooling power module with integrated gate drivers, decoupling capacitors (Cdec), temperature sensors, and a current sensor is proposed. 45-degree vertical connection blocks to provide maximum heat dissipation path were proposed. It electrically connects the bottom to the top direct bond copper (DBC) substrate to complete the half-bridge assembly. A low temperature co-fired ceramic (LTCC) based interposer providing mechanical strength between the two substrates and electrical isolation is used. The gate driver die integrated inside the module is a non-isolated single-channel driver with a variable drive strength control feature that can safely operate up to 175ºC. Giant magnetoresistance (GMR) based current measurement solution is implemented, which is contactless and can measure both AC and DC current. A multi-layer LTCC or printed circuit board (PCB) based AC power terminal is proposed to integrate the GMR sensor into the module. The power loop inductance of this highly integrated power module is 1.5 nH. The thermal resistance of this power module package is only 0.06 K/W. This work seeks to overcome the volumetric power density limitations of conventional packaging technologies.

Original language	English
Title of host publication	20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	475-479
Number of pages	5
ISBN (Electronic)	9781665401050
DOIs	https://doi.org/10.1109/NEWCAS52662.2022.9842249
State	Published - 2022
Event	20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Quebec City, Canada Duration: Jun 19 2022 → Jun 22 2022

Publication series

Name	20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings

Conference

Conference	20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022
Country/Territory	Canada
City	Quebec City
Period	06/19/22 → 06/22/22

Keywords

double-sided cooling
heterogeneously integrated module
LTCC
SiC power module

Access to Document

10.1109/NEWCAS52662.2022.9842249

Cite this

Paul, R., Faruque, A., Hassan, A., Alan Mantooth, H., Salehi Vala, S., Basit Mirza, A., & Luo, F. (2022). A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module. In 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings (pp. 475-479). (20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEWCAS52662.2022.9842249

Paul, Riya ; Faruque, Asif ; Hassan, Ayesha et al. / A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module. 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. pp. 475-479 (20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings).

@inproceedings{ffadf3a57bfd4a08896b2dfb0e229a93,

title = "A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module",

abstract = "A novel half-bridge silicon carbide (SiC) double-sided cooling power module with integrated gate drivers, decoupling capacitors (Cdec), temperature sensors, and a current sensor is proposed. 45-degree vertical connection blocks to provide maximum heat dissipation path were proposed. It electrically connects the bottom to the top direct bond copper (DBC) substrate to complete the half-bridge assembly. A low temperature co-fired ceramic (LTCC) based interposer providing mechanical strength between the two substrates and electrical isolation is used. The gate driver die integrated inside the module is a non-isolated single-channel driver with a variable drive strength control feature that can safely operate up to 175ºC. Giant magnetoresistance (GMR) based current measurement solution is implemented, which is contactless and can measure both AC and DC current. A multi-layer LTCC or printed circuit board (PCB) based AC power terminal is proposed to integrate the GMR sensor into the module. The power loop inductance of this highly integrated power module is 1.5 nH. The thermal resistance of this power module package is only 0.06 K/W. This work seeks to overcome the volumetric power density limitations of conventional packaging technologies.",

keywords = "double-sided cooling, heterogeneously integrated module, LTCC, SiC power module",

author = "Riya Paul and Asif Faruque and Ayesha Hassan and \{Alan Mantooth\}, H. and \{Salehi Vala\}, Sama and \{Basit Mirza\}, Abdul and Fang Luo",

note = "Publisher Copyright: {\textcopyright} 2022 IEEE.; 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 ; Conference date: 19-06-2022 Through 22-06-2022",

year = "2022",

doi = "10.1109/NEWCAS52662.2022.9842249",

language = "English",

series = "20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "475--479",

booktitle = "20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings",

}

Paul, R, Faruque, A, Hassan, A, Alan Mantooth, H, Salehi Vala, S, Basit Mirza, A & Luo, F 2022, A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module. in 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings. 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings, Institute of Electrical and Electronics Engineers Inc., pp. 475-479, 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022, Quebec City, Canada, 06/19/22. https://doi.org/10.1109/NEWCAS52662.2022.9842249

A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module. / Paul, Riya; Faruque, Asif; Hassan, Ayesha et al.
20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2022. p. 475-479 (20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module

AU - Paul, Riya

AU - Faruque, Asif

AU - Hassan, Ayesha

AU - Alan Mantooth, H.

AU - Salehi Vala, Sama

AU - Basit Mirza, Abdul

AU - Luo, Fang

PY - 2022

Y1 - 2022

N2 - A novel half-bridge silicon carbide (SiC) double-sided cooling power module with integrated gate drivers, decoupling capacitors (Cdec), temperature sensors, and a current sensor is proposed. 45-degree vertical connection blocks to provide maximum heat dissipation path were proposed. It electrically connects the bottom to the top direct bond copper (DBC) substrate to complete the half-bridge assembly. A low temperature co-fired ceramic (LTCC) based interposer providing mechanical strength between the two substrates and electrical isolation is used. The gate driver die integrated inside the module is a non-isolated single-channel driver with a variable drive strength control feature that can safely operate up to 175ºC. Giant magnetoresistance (GMR) based current measurement solution is implemented, which is contactless and can measure both AC and DC current. A multi-layer LTCC or printed circuit board (PCB) based AC power terminal is proposed to integrate the GMR sensor into the module. The power loop inductance of this highly integrated power module is 1.5 nH. The thermal resistance of this power module package is only 0.06 K/W. This work seeks to overcome the volumetric power density limitations of conventional packaging technologies.

AB - A novel half-bridge silicon carbide (SiC) double-sided cooling power module with integrated gate drivers, decoupling capacitors (Cdec), temperature sensors, and a current sensor is proposed. 45-degree vertical connection blocks to provide maximum heat dissipation path were proposed. It electrically connects the bottom to the top direct bond copper (DBC) substrate to complete the half-bridge assembly. A low temperature co-fired ceramic (LTCC) based interposer providing mechanical strength between the two substrates and electrical isolation is used. The gate driver die integrated inside the module is a non-isolated single-channel driver with a variable drive strength control feature that can safely operate up to 175ºC. Giant magnetoresistance (GMR) based current measurement solution is implemented, which is contactless and can measure both AC and DC current. A multi-layer LTCC or printed circuit board (PCB) based AC power terminal is proposed to integrate the GMR sensor into the module. The power loop inductance of this highly integrated power module is 1.5 nH. The thermal resistance of this power module package is only 0.06 K/W. This work seeks to overcome the volumetric power density limitations of conventional packaging technologies.

KW - double-sided cooling

KW - heterogeneously integrated module

KW - LTCC

KW - SiC power module

UR - https://www.scopus.com/pages/publications/85138699875

U2 - 10.1109/NEWCAS52662.2022.9842249

DO - 10.1109/NEWCAS52662.2022.9842249

M3 - Conference contribution

AN - SCOPUS:85138699875

T3 - 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings

SP - 475

EP - 479

BT - 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022

Y2 - 19 June 2022 through 22 June 2022

ER -

Paul R, Faruque A, Hassan A, Alan Mantooth H, Salehi Vala S, Basit Mirza A et al. A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module. In 20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2022. p. 475-479. (20th IEEE International Interregional NEWCAS Conference, NEWCAS 2022 - Proceedings). doi: 10.1109/NEWCAS52662.2022.9842249

A Heterogeneously Integrated Double-Sided Cooling Silicon Carbide Power Module

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Keywords

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