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A statistical approach to real-time updating and automatic scheduling of physical models

  • IBM
  • Virginia Polytechnic Institute and State University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Energy consumption of data center has increased dramatically due to the massive computing demands driven from every sector of the economy. Hence, data center energy management has become very important for operating data centers within environmental standards while achieving low energy cost. In order to advance the understanding of thermal management in data centers, relevant environmental information such as temperature, humidity and air quality are gathered through a network of realtime sensors or simulated via sophisticated physical models (e.g. computational fluid dynamics models). However, sensor readings of environmental parameters are collected only at sparse locations and thus cannot provide a detailed map of temperature distribution for the entire data center. While the physics models yield high resolution temperature maps, it is often not feasible, due to computational complexity of these models, to run them in real-time, which is ideally required for optimum data center operation and management. In this work, we propose a novel statistical modeling approach to updating physical model outputs in real-time and providing automatic scheduling for recomputing physical model outputs. The proposed method dynamically corrects the discrepancy between a steady-state output of the physical model and real-time thermal sensor data. We show that the proposed method can provide valuable information for data center energy management such as real-time highresolution thermal maps. Moreover, it can efficiently detect systematic changes in a data center thermal environment, and automatically schedule physical models to be re-executed whenever significant changes are detected.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
StatePublished - 2013
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: Jul 16 2013Jul 18 2013

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume2

Conference

ConferenceASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Country/TerritoryUnited States
CityBurlingame, CA
Period07/16/1307/18/13

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