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Capacitively Coupled LAPPDs with 2D Pixelated Readout Planes for Time of Flight and Ring Imaging Cherenkov Applications

  • A. Kiselev
  • , M. Alfred
  • , R. Alrashidi
  • , A. Alsayegh
  • , M. Aviles
  • , B. Azmoun
  • , S. Butler
  • , M. Chiu
  • , T. Cremer
  • , K. Dehmelt
  • , A. Deshpande
  • , M. Foley
  • , P. Garg
  • , C. Hamel
  • , M. Harvey
  • , X. He
  • , A. Holt
  • , T. K. Hemmick
  • , S. Kuudaar
  • , A. Lyashenko
  • L. Mwibanda, M. Minot, S. Nelson, S. Park, M. Popecki, M. L. Purschke, C. M. Sarsour, C. Scarlett, B. Schmookler, M. Stochaj, C. Walne, P. Whitney, C. Woody, J. Xie
  • United States Department of Energy
  • Florida A&M University
  • Incom Inc.
  • Stony Brook University
  • Texas Southern University
  • Georgia State University
  • Howard University
  • Mississippi State University
  • Argonne National Laboratory

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

Large Area Picosecond Photon Detectors (LAPPDs) are micro-channel plate based photosensors featuring hundreds of square centimeters of sensitive area in a single package and capable of providing timing resolution on the order of 50 ps for single photon detection. However, LAPPDs currently do not exist in finely pixelated 2D readout configurations which, in addition to high-resolution timing, would also provide high spatial resolution required for Ring Imaging CHerenkov (RICH) detectors. One of the recent LAPPD models (Gen II) provides the opportunity to overcome the lack of pixellation by coupling an external readout to the sealed detector itself. The readout plane in this case is a simple printed circuit board (PCB) that can be laid out in a custom application-specific way for 1D or 2D sensitive area pixellation. This allows for a much shorter readout-plane prototyping cycle and provides unprecedented flexibility in choosing an appropriate segmentation that can be optimized for any particular detector need in terms of pad size, orientation, and shape. We fully exploit this feature by designing and testing a variety of readout PCBs with conventional square pads and interleaved anode designs. Data acquired in the lab using a laser system to probe the response of several interleaved and standard pixelated patterns are presented as well as results from a beam test.

Original languageEnglish
Title of host publication2021 IEEE Nuclear Science Symposium and Medical Imaging Conference Record, NSS/MIC 2021 and 28th International Symposium on Room-Temperature Semiconductor Detectors, RTSD 2022
EditorsHideki Tomita, Tatsuya Nakamura
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665421133
DOIs
StatePublished - 2021
Event2021 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2021 - Virtual, Yokohama, Japan
Duration: Oct 16 2021Oct 23 2021

Publication series

Name2021 IEEE Nuclear Science Symposium and Medical Imaging Conference Record, NSS/MIC 2021 and 28th International Symposium on Room-Temperature Semiconductor Detectors, RTSD 2022

Conference

Conference2021 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2021
Country/TerritoryJapan
CityVirtual, Yokohama
Period10/16/2110/23/21

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