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COMPOFF: A Compiler Cost model using Machine Learning to predict the Cost of OpenMP Offloading

  • Alok Mishra
  • , Smeet Chheda
  • , Carlos Soto
  • , Abid M. Malik
  • , Meifeng Lin
  • , Barbara Chapman
  • Stony Brook University
  • Brookhaven National Laboratory

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

The HPC industry is inexorably moving towards an era of extremely heterogeneous architectures, with more devices configured on any given HPC platform and potentially more kinds of devices, some of them highly specialized. Writing a separate code suitable for each target system for a given HPC application is not practical. The better solution is to use directive-based parallel programming models such as OpenMP. OpenMP provides a number of options for offloading a piece of code to devices like GPUs. To select the best option from such options during compilation, most modern compilers use analytical models to estimate the cost of executing the original code and the different offloading code variants. Building such an analytical model for compilers is a difficult task that necessi-tates a lot of effort on the part of a compiler engineer. Recently, machine learning techniques have been successfully applied to build cost models for a variety of compiler optimization problems. In this paper, we present COMPOFF, a cost model that statically estimates the Cost of OpenMP OFFloading using a neural network model. We used six different transformations on a parallel code of Wilson Dslash Operator to support GPU offloading, and we predicted their cost of execution on different GPUs using COMPOFF during compile time. Our results show that this model can predict offloading costs with a root mean squared error in prediction of less than 0.5 seconds. Our preliminary findings indicate that this work will make it much easier and faster for scientists and compiler developers to port legacy HPC applications that use OpenMP to new heterogeneous computing environment.

Original languageEnglish
Title of host publicationProceedings - 2022 IEEE 36th International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages391-400
Number of pages10
ISBN (Electronic)9781665497473
DOIs
StatePublished - 2022
Event36th IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2022 - Virtual, Online, France
Duration: May 30 2022Jun 3 2022

Publication series

NameProceedings - 2022 IEEE 36th International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2022

Conference

Conference36th IEEE International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2022
Country/TerritoryFrance
CityVirtual, Online
Period05/30/2206/3/22

Keywords

  • cost model
  • gpu
  • machine learning
  • openmp

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