TY - GEN
T1 - Computational design and 3d weaving of 2D-printable conformal flexible electronics using harmonic foliation theory
AU - Ye, Qian
AU - Guo, Yang
AU - Gu, Xianfeng David
AU - Chen, Shikui
N1 - Publisher Copyright:
Copyright © 2021 by ASME
PY - 2021
Y1 - 2021
N2 - This paper proposes a new way of designing and fabricating conformal flexible electronics on free-form surfaces, which can generate woven flexible electronics designs conforming to free-form 3D shapes with 2D printed electronic circuits. Utilizing our recently proposed foliation-based 3D weaving techniques, we can reap unprecedented advantages in conventional 2D electronic printing. The method is based on the foliation theory in differential geometry, which divides a surface into parallel leaves. Given a surface with circuit design, we first calculate a graph-value harmonic map and then create two sets of harmonic foliations perpendicular to each other. As the circuits are processed as the texture on the surface, they are separated and attached to each leaf. The warp and weft threads are then created and manually woven to reconstruct the surface and reconnect the circuits. Notably, The circuits are printed in 2D, which uniquely differentiates the proposed method from others. Compared with costly conformal 3D electronic printing methods requiring 5-axis CNC machines, our method is more reliable, more efficient, and economical. Moreover, the Harmonic foliation theory assures smoothness and orthogonality between every pair of woven yarns, which guarantees the precision of the flexible electronics woven on the surface. The proposed method provides an alternative solution to the design and physical realization of surface electronic textiles for various applications, including wearable electronics, sheet metal craft, architectural designs, and smart woven-composite parts with conformal sensors in the automotive and aerospace industry. The performance of the proposed method is depicted using two examples.
AB - This paper proposes a new way of designing and fabricating conformal flexible electronics on free-form surfaces, which can generate woven flexible electronics designs conforming to free-form 3D shapes with 2D printed electronic circuits. Utilizing our recently proposed foliation-based 3D weaving techniques, we can reap unprecedented advantages in conventional 2D electronic printing. The method is based on the foliation theory in differential geometry, which divides a surface into parallel leaves. Given a surface with circuit design, we first calculate a graph-value harmonic map and then create two sets of harmonic foliations perpendicular to each other. As the circuits are processed as the texture on the surface, they are separated and attached to each leaf. The warp and weft threads are then created and manually woven to reconstruct the surface and reconnect the circuits. Notably, The circuits are printed in 2D, which uniquely differentiates the proposed method from others. Compared with costly conformal 3D electronic printing methods requiring 5-axis CNC machines, our method is more reliable, more efficient, and economical. Moreover, the Harmonic foliation theory assures smoothness and orthogonality between every pair of woven yarns, which guarantees the precision of the flexible electronics woven on the surface. The proposed method provides an alternative solution to the design and physical realization of surface electronic textiles for various applications, including wearable electronics, sheet metal craft, architectural designs, and smart woven-composite parts with conformal sensors in the automotive and aerospace industry. The performance of the proposed method is depicted using two examples.
UR - https://www.scopus.com/pages/publications/85119987117
U2 - 10.1115/DETC2021-67811
DO - 10.1115/DETC2021-67811
M3 - Conference contribution
AN - SCOPUS:85119987117
T3 - Proceedings of the ASME Design Engineering Technical Conference
BT - 41st Computers and Information in Engineering Conference (CIE)
PB - American Society of Mechanical Engineers (ASME)
T2 - 41st Computers and Information in Engineering Conference, CIE 2021, Held as Part of the ASME 2021 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC-CIE 2021
Y2 - 17 August 2021 through 19 August 2021
ER -