TY - GEN
T1 - Development of a TLM to investigate the effect of a resistive interface in digital flat panel x-ray detectors
AU - Segui, J. A.
AU - Zhao, W.
PY - 2007
Y1 - 2007
N2 - Novel flat panel x-ray detector (FPD) technologies are currently under development for advanced medical imaging applications. A typical detector consists of a method to detect x-rays, convert absorbed x-ray energy to charge, and perform readout of charge. New designs are increasingly complex and often require additional materials to enhance charge transport or structural properties of the detector. A resistive interface layer (RIL) may be used to perform any of these functional roles and its impact on FPD performance was investigated. In this work, we developed a transmission line model (TLM) to investigate the effect of RIL thickness and resistivity on charge transport and image quality of a FPD.
AB - Novel flat panel x-ray detector (FPD) technologies are currently under development for advanced medical imaging applications. A typical detector consists of a method to detect x-rays, convert absorbed x-ray energy to charge, and perform readout of charge. New designs are increasingly complex and often require additional materials to enhance charge transport or structural properties of the detector. A resistive interface layer (RIL) may be used to perform any of these functional roles and its impact on FPD performance was investigated. In this work, we developed a transmission line model (TLM) to investigate the effect of RIL thickness and resistivity on charge transport and image quality of a FPD.
UR - https://www.scopus.com/pages/publications/48749122569
U2 - 10.1109/NEBC.2007.4413292
DO - 10.1109/NEBC.2007.4413292
M3 - Conference contribution
AN - SCOPUS:48749122569
SN - 1424410339
SN - 9781424410330
T3 - Proceedings of the IEEE Annual Northeast Bioengineering Conference, NEBEC
SP - 88
EP - 89
BT - 33rd Annual Northeast Bioengineering Conference - Engineering Innovations in Life Sciences and Healthcare, NEBC
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd Annual Northeast Bioengineering Conference, NEBC
Y2 - 10 March 2007 through 11 March 2007
ER -