TY - GEN
T1 - Direct-write thermal spray for sensors and electronics
T2 - Digital Fabrication 2006
AU - Longtin, J. P.
AU - Sampath, S.
AU - Gambino, R. J.
AU - Greenlaw, R. J.
AU - Brogan, J.
PY - 2006
Y1 - 2006
N2 - This paper provides an overview of Direct-Write Thermal Spray (DWTS), an emerging technology under development for nearly a decade at Stony Brook and MesoScribe Technologies, Inc. DWTS is a direct-write fabrication technology that provides material versatility, no need for post-firing or curing, fast deposition rates, and feature sizes from centimeters to several tens of microns, particularly when used with laser micromachining. Metals, dielectrics, polymers, and even semiconductor materials can be deposited. Applications include sensors for harsh environments such as thermocouples, heat flux sensors, and resistive and capacitive strain gauges; passive electronics, including planar capacitors, inductors, transformers and multi-layer structures; and technologies for RF and wireless sensor applications. The paper concludes with observations on future directions and applications.
AB - This paper provides an overview of Direct-Write Thermal Spray (DWTS), an emerging technology under development for nearly a decade at Stony Brook and MesoScribe Technologies, Inc. DWTS is a direct-write fabrication technology that provides material versatility, no need for post-firing or curing, fast deposition rates, and feature sizes from centimeters to several tens of microns, particularly when used with laser micromachining. Metals, dielectrics, polymers, and even semiconductor materials can be deposited. Applications include sensors for harsh environments such as thermocouples, heat flux sensors, and resistive and capacitive strain gauges; passive electronics, including planar capacitors, inductors, transformers and multi-layer structures; and technologies for RF and wireless sensor applications. The paper concludes with observations on future directions and applications.
UR - https://www.scopus.com/pages/publications/33947286250
M3 - Conference contribution
AN - SCOPUS:33947286250
SN - 089208264X
SN - 9780892082643
T3 - Digital Fabrication 2006 - Final Program and Proceedings
SP - 116
EP - 119
BT - Digital Fabrication 2006 - Final Program and Proceedings
Y2 - 17 September 2006 through 22 September 2006
ER -