@inproceedings{07583a7d7aa340bb8d74f8a1ac850075,
title = "Efficient characterization of TSV-to-transistor noise coupling in 3D ICs",
abstract = "A methodology is proposed to characterize TSV induced noise coupling in three-dimensional (3D) integrated circuits. Different substrate biasing schemes (such as a single substrate contact versus regularly placed substrate contacts) and TSV fabrication methods (such as via-first and via-last) are considered. A compact model is proposed to efficiently estimate the coupling noise at a victim transistor. Each admittance within the compact model is approximated with a closed-form expression consisting of logarithmic functions. The methodology is validated using a 3D transmission line matrix (3D-TLM) method, demonstrating, on average, 4.8\% error. The compact model and the closed-form expressions are utilized to better understand TSV induced noise as a function of multiple parameters such as TSV type and placement of substrate contacts.",
keywords = "3d ic, compact model, noise, tsv",
author = "Hailang Wang and Asgari, \{Mohammad H.\} and Emre Salman",
year = "2013",
doi = "10.1145/2483028.2483064",
language = "English",
isbn = "9781450319027",
series = "Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI",
pages = "71--76",
booktitle = "GLSVLSI 2013 - Proceedings of the ACM International Conference of the Great Lakes Symposium on VLSI",
note = "23rd ACM International Conference of the Great Lakes Symposium on VLSI, GLSVLSI 2013 ; Conference date: 02-05-2013 Through 03-05-2013",
}