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Embedded resistive strain sensors for harsh environments

  • MesoScribe Technologies, Inc.

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Scopus citations

Abstract

Strain gages developed using high-definition direct write technology enable direct bonding to substrates without an adhesive layer, so greater shear forces may be faithfully transmitted and thicker, more robust conductors may be used for strain-sensing. Effects of hysteresis, creep, and temperature limitations common to adhesively-bonded gages can also be mitigated. Manufacture and installation of the gage (and lead wires) are automatic and simultaneous, reducing preparation time and cost. Using the above developed method, industrial-grade strain gages have been fabricated and tested. Standard gage resistances between 120Ω-350Ω have been achieved on grids smaller than 10mm2 using nickel-chrome as the gage material. Thermal plasma-sprayed laser-cut resistive gages have achieved gage factors of 1.3, operating linearly and repeatably for more than 105 cycles between ±1000με. Additional performance metrics e.g., temperature sensitivity and compensation, will be treated in this paper.

Original languageEnglish
Title of host publication2006 IEEE Aerospace Conference
StatePublished - 2006
Event2006 IEEE Aerospace Conference - Big Sky, MT, United States
Duration: Mar 4 2006Mar 11 2006

Publication series

NameIEEE Aerospace Conference Proceedings
Volume2006
ISSN (Print)1095-323X

Conference

Conference2006 IEEE Aerospace Conference
Country/TerritoryUnited States
CityBig Sky, MT
Period03/4/0603/11/06

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