Skip to main navigation Skip to search Skip to main content

Estimation of lattice strain in 4H-SiC commercial wafer by synchrotron monochromatic X-ray topographic contour mapping

  • Stony Brook University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

The presence of lattice imperfections in n-doped 4H-SiC substrate crystals grown by physical vapor transport (PVT) leads to a nonuniform distribution of lattice strain. Residual stress raised from the lattice strain has a significant impact on the performance of related power devices. It is thus important to estimate the level and the variation of lattice strain in these crystals. In this study, a method is developed based on synchrotron monochromatic X-ray topography (SMBXT) to measure local strain field in 4H-SiC commercial wafers. This method is applied to a 75mm wafer and the strain map of the entire wafer is obtained. Results show that the level of lattice strain is much more significant than that of lattice tilt in 4H-SiC crystals.

Original languageEnglish
Title of host publicationECS Transactions
EditorsM. Dudley, M. Bakowski, N. Ohtani, B. Raghothamachar, K. Shenai
PublisherElectrochemical Society Inc.
Pages245-250
Number of pages6
Edition7
ISBN (Electronic)9781607688242
DOIs
StatePublished - Aug 17 2017
EventGallium Nitride and Silicon Carbide Power Technologies 7 - 232nd ECS Meeting - National Harbor, United States
Duration: Oct 1 2017Oct 5 2017

Publication series

NameECS Transactions
Number7
Volume80
ISSN (Print)1938-6737
ISSN (Electronic)1938-5862

Conference

ConferenceGallium Nitride and Silicon Carbide Power Technologies 7 - 232nd ECS Meeting
Country/TerritoryUnited States
CityNational Harbor
Period10/1/1710/5/17

Fingerprint

Dive into the research topics of 'Estimation of lattice strain in 4H-SiC commercial wafer by synchrotron monochromatic X-ray topographic contour mapping'. Together they form a unique fingerprint.

Cite this