Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level: Part 2

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	2154-2156
Number of pages	3
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	14
Issue number	12
DOIs	https://doi.org/10.1109/TCPMT.2024.3505652
State	Published - 2024

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title = "Foreword: Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level: Part 2",

author = "Przemyslaw Gromala and Fang Luo and Sreekant Narumanchi",

year = "2024",

doi = "10.1109/TCPMT.2024.3505652",

language = "English",

volume = "14",

pages = "2154--2156",

journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",

issn = "2156-3950",

number = "12",

}

TY - JOUR

T1 - Foreword

T2 - Special Section on Multiphysics Aspects of Power Electronics Packaging - Power Die, Power Module, and Converter Level: Part 2

AU - Gromala, Przemyslaw

AU - Luo, Fang

AU - Narumanchi, Sreekant

PY - 2024

Y1 - 2024

UR - https://www.scopus.com/pages/publications/85214357833

U2 - 10.1109/TCPMT.2024.3505652

DO - 10.1109/TCPMT.2024.3505652

M3 - Editorial

AN - SCOPUS:85214357833

SN - 2156-3950

VL - 14

SP - 2154

EP - 2156

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 12

ER -