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Hardware Design and Implementation of a 75 kVA 3-D Integrated Intelligent Power Stage

  • Abdul Basit Mirza
  • , Asif Imran Emon
  • , Kushan Choksi
  • , Sama Salehi Vala
  • , Fang Luo
  • , Radha Krishna Moorthy
  • , Madhu Sudhan Chinthavali
  • Stony Brook University
  • Oak Ridge National Laboratory

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

Abstract

With a vision to increase power density and standardize power electronics interface with the grid, this paper presents the design and validation of a SiC-based 75 kVA Intelligent Power Stage (IPS), comprising DC-DC and DC-AC power stages. The IPS is built on a modular 3D structure platform, where all three sides of the heat sink are utilized to achieve high power density (5.5 kW/L), including passives. The heat sink is custom-built and optimized to channel power from all three sides. Moreover, the intelligent features involve online non-invasive health monitoring of power stage components through a pseudo-optimized Digital Twin (DT) approach. DT also aids in identifying system failure modes, providing an extra layer of protection. Lastly, for grid-tie operation and interoperability, a hierarchical controller Smart Universal Power Electronics Regulator (SUPER) is proposed, which controls the DC-AC stage and monitors the health of IPS components through control and data communication channels.

Original languageEnglish
Title of host publicationAPEC 2023 - 38th Annual IEEE Applied Power Electronics Conference and Exposition
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages977-983
Number of pages7
ISBN (Electronic)9781665475396
DOIs
StatePublished - 2023
Event38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023 - Orlando, United States
Duration: Mar 19 2023Mar 23 2023

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume2023-March

Conference

Conference38th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2023
Country/TerritoryUnited States
CityOrlando
Period03/19/2303/23/23

Keywords

  • 3-D Packaging
  • Digital Twin (DT)
  • Intelligent Power Stage (IPS)
  • Particle Swarm Optimization (PSO)
  • SiC
  • Split-Phase Inverter
  • Three-Faced Utilized Heat Sink

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