@inproceedings{2a5fe6e7654647e6970ca56ea5cce7d1,
title = "Hardware security threats and potential countermeasures in emerging 3D ICs",
abstract = "New hardware security threats are identified in emerging three-dimensional (3D) integrated circuits (ICs) and potential counter-measures are introduced. Trigger and payload mechanisms for future 3D hardware Trojans are predicted. Furthermore, a novel, network-on-chip based 3D obfuscation method is proposed to block the direct communication between two commercial dies in a 3D structure, thus thwarting reverse engineering attacks on the vertical dimension. Simulation results demonstrate that the proposed method effectively obfuscates the cross-plane communication by increasing the reverse engineering time by approximately 5× as compared to using direct through silicon via (TSV) connections. The proposed method consumes approximately one fifth the area and power of a typical network-on-chip designed in a 65 nm technology, exhibiting limited overhead.",
keywords = "3D ICs, Hardware security, Network-on-Chip",
author = "Jaya Dofe and Qiaoyan Yu and Hailang Wang and Emre Salman",
note = "Publisher Copyright: {\textcopyright} 2016 ACM.; 26th ACM Great Lakes Symposium on VLSI, GLSVLSI 2016 ; Conference date: 18-05-2016 Through 20-05-2016",
year = "2016",
month = may,
day = "18",
doi = "10.1145/2902961.2903014",
language = "English",
series = "Proceedings of the ACM Great Lakes Symposium on VLSI, GLSVLSI",
publisher = "Association for Computing Machinery",
pages = "69--74",
booktitle = "GLSVLSI 2016 - Proceedings of the 2016 ACM Great Lakes Symposium on VLSI",
}