@inproceedings{dc651819980740cfbf65a77b154233a9,
title = "Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics",
abstract = "This study aims to provide an additive manufacturing-based pathway for addressing issues concerned with the reliability of high-density electronic packaging. It compares the performance of a non-metallic, additively manufactured heat spreader with that of a conventional cold plate. CFD software is first used to evaluate the heat spreaders with respect to cooling capability. Furthermore, the device is experimentally tested in a flow loop and its performance compared to that of the cold plate. Initial simulation results show the additively manufactured plastic heat sinks provide a uniform cooling profile and maintain lower maximum temperatures seen in the power module. Experimental results show a lower pressure drop seen is seen in the heat spreader over a wide range of flow rates. Moreover, the use of plastics shows a clear discount of EMI while keeping the material cost and the device weight at a reduced level.",
keywords = "Array, Convection, Flow, Fluid, Heat spreading, Impingement, Internal geometry, Jet, Manifold",
author = "Reece Whitt and Bakhtiyar Nafis and David Huitink and Zhao Yuan and Amol Deshpande and Balaji Narayanasamy and Fang Luo",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE; 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 ; Conference date: 28-05-2019 Through 31-05-2019",
year = "2019",
month = may,
doi = "10.1109/ITHERM.2019.8757275",
language = "English",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "451--455",
booktitle = "Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019",
}