TY - GEN
T1 - Humidity control and dew point management
AU - Klein, Levente J.
AU - Hamann, Hendrik F.
PY - 2011
Y1 - 2011
N2 - Humidity control in buildings is important for several reasons ranging from ensuring comfort of the occupants to mold control. While the optimum humidity range can be different depending on the function of a particular facility, data centers require especially tight control of humidity and dew point. For example, at low humidity (electro-static discharge) ESD might impose a significant risk to the computing equipment while at high humidity levels hardware failures are more probable due to the growth of conductive filaments or corrosion of circuit boards. In this paper we present a detailed comparison of data centers from several geographical locations, where we have measured humidity and temperature distributions over extended periods of time. The data are analyzed in terms of spatial and temporal dew point variations. We derive detailed dew point "maps" of the respective data center and the impact on reliability and energy efficiency is being discussed.
AB - Humidity control in buildings is important for several reasons ranging from ensuring comfort of the occupants to mold control. While the optimum humidity range can be different depending on the function of a particular facility, data centers require especially tight control of humidity and dew point. For example, at low humidity (electro-static discharge) ESD might impose a significant risk to the computing equipment while at high humidity levels hardware failures are more probable due to the growth of conductive filaments or corrosion of circuit boards. In this paper we present a detailed comparison of data centers from several geographical locations, where we have measured humidity and temperature distributions over extended periods of time. The data are analyzed in terms of spatial and temporal dew point variations. We derive detailed dew point "maps" of the respective data center and the impact on reliability and energy efficiency is being discussed.
UR - https://www.scopus.com/pages/publications/84860347874
U2 - 10.1115/IPACK2011-52211
DO - 10.1115/IPACK2011-52211
M3 - Conference contribution
AN - SCOPUS:84860347874
SN - 9780791844618
T3 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
SP - 629
EP - 635
BT - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
T2 - ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, InterPACK 2011
Y2 - 6 July 2011 through 8 July 2011
ER -