TY - GEN
T1 - Impact of power granularity on chip thermal modeling
AU - Etessam-Yazdani, Keivan
AU - Hamann, Hendrik F.
AU - Asheghi, Mehdi
PY - 2006
Y1 - 2006
N2 - In this paper we investigate the impact of the granularity of the power distribution for accurately predicting semiconductor chip temperature fields. Specifically, we calculate the transfer functions between power distributions and resulting temperature maps for various microprocessor packages and cooling conditions, which establish a minimum granularity required for accurate thermal analysis. The purpose of this paper is twofold: First, we like to provide some general guidelines for the impact of different power granularities on the global chip temperatures and second we intend to spike a broader discussion about to which extent small heating effects can affect chip temperatures for circuits under full operation. As such this work is not only beneficial for package and cooling solution engineering but also important to circuit designers and computer architects in their battle against hotspots in microprocessors.
AB - In this paper we investigate the impact of the granularity of the power distribution for accurately predicting semiconductor chip temperature fields. Specifically, we calculate the transfer functions between power distributions and resulting temperature maps for various microprocessor packages and cooling conditions, which establish a minimum granularity required for accurate thermal analysis. The purpose of this paper is twofold: First, we like to provide some general guidelines for the impact of different power granularities on the global chip temperatures and second we intend to spike a broader discussion about to which extent small heating effects can affect chip temperatures for circuits under full operation. As such this work is not only beneficial for package and cooling solution engineering but also important to circuit designers and computer architects in their battle against hotspots in microprocessors.
UR - https://www.scopus.com/pages/publications/33845590702
U2 - 10.1109/ITHERM.2006.1645409
DO - 10.1109/ITHERM.2006.1645409
M3 - Conference contribution
AN - SCOPUS:33845590702
SN - 0780395247
SN - 9780780395244
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 666
EP - 670
BT - Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
T2 - 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Y2 - 30 May 2006 through 2 June 2006
ER -