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In-package spiral inductor characterization for high efficiency buck converters

  • Stony Brook University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

The applicability of package-embedded spiral inductors to switching buck converters is demonstrated. In the first step, the design and characterization process of package-embedded spiral inductors is investigated via comprehensive full wave electromagnetic simulations, while considering a realistic, multi-layer flip-chip package. An interleaved multi-phase buck converter with an array of package-embedded spiral inductors is developed in the second step. The converter produces an output voltage of 0.9 V from 1.2 V input voltage while supplying a load current of 1 A. The flexibility of the package is exploited to obtain a relatively high inductance, enabling a reduced switching frequency. Lower switching frequency minimizes the dynamic loss, thereby increasing the power efficiency. According to the extracted results of the overall layout, power efficiency of approximately 89% is achieved with 3% output ripple voltage.

Original languageEnglish
Title of host publicationIEEE International Symposium on Circuits and Systems
Subtitle of host publicationFrom Dreams to Innovation, ISCAS 2017 - Conference Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781467368520
DOIs
StatePublished - Sep 25 2017
Event50th IEEE International Symposium on Circuits and Systems, ISCAS 2017 - Baltimore, United States
Duration: May 28 2017May 31 2017

Publication series

NameProceedings - IEEE International Symposium on Circuits and Systems
ISSN (Print)0271-4310

Conference

Conference50th IEEE International Symposium on Circuits and Systems, ISCAS 2017
Country/TerritoryUnited States
CityBaltimore
Period05/28/1705/31/17

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