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Influence of dopant concentration on dislocation distributions in 150mm 4H SiC wafers

  • Dow Chemical
  • Stony Brook University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

6 Scopus citations

Abstract

Shifts in the spatial distribution of threading dislocations in 150 mm 4H SiC wafers were examined as a response to intentional changes in both the flow of the nitrogen source gas used to control resistivity during bulk crystal growth, and the growth rate. The density of threading edge and screw dislocations was found to be more evenly distributed in wafers produced under a high-growth rate, low-resistivity process. This result corresponded to a flattening of the resistivity distribution, and a ~34% reduction in on-and off-facet resistivity differential. The effect was attributed to regularized 4H island coalescence due to modulation of step terrace width.

Original languageEnglish
Title of host publicationSilicon Carbide and Related Materials, 2018
EditorsPeter M. Gammon, Vishal A. Shah, Richard A. McMahon, Michael R. Jennings, Oliver Vavasour, Philip A. Mawby, Faye Padfield
PublisherTrans Tech Publications Ltd
Pages60-63
Number of pages4
ISBN (Print)9783035713329
DOIs
StatePublished - 2019
Event12th European Conference on Silicon Carbide and Related Materials, ECSCRM 2018 - Birmingham, United Kingdom
Duration: Sep 2 2018Sep 6 2018

Publication series

NameMaterials Science Forum
Volume963 MSF
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference12th European Conference on Silicon Carbide and Related Materials, ECSCRM 2018
Country/TerritoryUnited Kingdom
CityBirmingham
Period09/2/1809/6/18

Keywords

  • Defect mapping
  • KOH etching
  • Nitrogen doping
  • Resistivity
  • Step bunching
  • Threading edge dislocations
  • Threading screw dislocations

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