TY - GEN
T1 - Interaction Between Wire and Ingot in Wiresaw Slicing
AU - Yang, Fuqian
AU - Li, J. C.M.
AU - Kao, Imin
N1 - Publisher Copyright:
© 1999 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1999
Y1 - 1999
N2 - The deformation of the wire in the wiresaw slicing process was studied by considering directly the mechanical interaction between the wire and the ingot. The wire tension on the upstream is larger than on the downstream due to the friction force between the wire and the ingot. The tension difference across the cutting zone increases with friction and the span of the contact zone. The pressure in the contact zone increases from the entrance to the exit if the wire bending stiffness is ignored. The finite element results show that the wire bending stiffness plays an important role in the wire deformation. Higher wire bending stiffness (larger wire size) generates higher force acting onto the ingot for the same amount of wire deformation, which will leads to higher material removal rate and kerf loss. While larger wire span will reduce the force acting onto the ingot for a given ingot displacement in the direction perpendicular to the wire.
AB - The deformation of the wire in the wiresaw slicing process was studied by considering directly the mechanical interaction between the wire and the ingot. The wire tension on the upstream is larger than on the downstream due to the friction force between the wire and the ingot. The tension difference across the cutting zone increases with friction and the span of the contact zone. The pressure in the contact zone increases from the entrance to the exit if the wire bending stiffness is ignored. The finite element results show that the wire bending stiffness plays an important role in the wire deformation. Higher wire bending stiffness (larger wire size) generates higher force acting onto the ingot for the same amount of wire deformation, which will leads to higher material removal rate and kerf loss. While larger wire span will reduce the force acting onto the ingot for a given ingot displacement in the direction perpendicular to the wire.
UR - https://www.scopus.com/pages/publications/85122620428
U2 - 10.1115/IMECE1999-0910
DO - 10.1115/IMECE1999-0910
M3 - Conference contribution
AN - SCOPUS:85122620428
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 3
EP - 8
BT - Electronics Manufacturing Issues
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Y2 - 14 November 1999 through 19 November 1999
ER -