TY - GEN
T1 - Investigation of low angle grain boundaries in hexagonal silicon carbide
AU - Chen, Yi
AU - Chen, Hui
AU - Zhang, Ning
AU - Dudley, Michael
AU - Ma, Ronghui
PY - 2006
Y1 - 2006
N2 - Interaction between basal plane dislocations and single or well-spaced threading dislocations is discussed based on synchrotron white beam X-ray topographic studies carried out on physical vapor transport grown hexagonal silicon carbide single crystals. The basal plane dislocations are able to cut through single or well-spaced threading edge dislocations even if the formation of kinks/jogs is energetically unfavorable while threading screw dislocations were mostly observed to act as effective pinning points. However, basal plane dislocations can sometimes cut through a threading screw dislocation, forming a superjog and which subsequently migrates on the prismatic plane via a cross-slip process. Threading edge dislocation walls act as obstacles for the glide of basal plane dislocations and the mechanism by which this occurs is discussed. The character of low angle grain boundaries and their dislocation content are discussed.
AB - Interaction between basal plane dislocations and single or well-spaced threading dislocations is discussed based on synchrotron white beam X-ray topographic studies carried out on physical vapor transport grown hexagonal silicon carbide single crystals. The basal plane dislocations are able to cut through single or well-spaced threading edge dislocations even if the formation of kinks/jogs is energetically unfavorable while threading screw dislocations were mostly observed to act as effective pinning points. However, basal plane dislocations can sometimes cut through a threading screw dislocation, forming a superjog and which subsequently migrates on the prismatic plane via a cross-slip process. Threading edge dislocation walls act as obstacles for the glide of basal plane dislocations and the mechanism by which this occurs is discussed. The character of low angle grain boundaries and their dislocation content are discussed.
UR - https://www.scopus.com/pages/publications/40949161088
U2 - 10.1557/proc-0955-i07-50
DO - 10.1557/proc-0955-i07-50
M3 - Conference contribution
AN - SCOPUS:40949161088
SN - 9781604234114
T3 - Materials Research Society Symposium Proceedings
SP - 261
EP - 266
BT - Advances in III-V Nitride Semiconductor Materials and Devices
PB - Materials Research Society
T2 - 2006 MRS Fall Meeting
Y2 - 27 November 2006 through 1 December 2006
ER -