Abstract
Oxygenated polycrystalline silicon films containing different oxygen contents are ion‐implanted with phosphorus atoms. The films are either furnace annealed at 1073 and 1173 K, respectively, for 15 min or rapidly thermally annealed by halogen lamps in the temperature range from 1073 to 1373 K with annealing times between 6 and 40 s. Rutherford backscattering spectrometry (RBS) and IR spectrometry are carried out to determine the oxygen content and the free carrier concentration. The annealing eauses structure densification of SIPOS films. Short‐time annealing (10 s) gives the highest free carrier concentration.
| Original language | English |
|---|---|
| Pages (from-to) | 181-187 |
| Number of pages | 7 |
| Journal | physica status solidi (a) |
| Volume | 110 |
| Issue number | 1 |
| DOIs | |
| State | Published - Nov 16 1988 |
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