Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography

Kristian Andreini; J. Eric Tkaczyk; Tan Zhang; Yana Z. Williams; Chris Nafis; Gil Abramovich; Kevin Harding; Peter J. Bednarczyk; Henry Chen; Glenn Bindley; Jason McKenzie; Balaji Ragothomachar; Michael Dudley

doi:10.1109/NSSMIC.2010.5874497

Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography

Kristian Andreini
, J. Eric Tkaczyk
, Tan Zhang
, Yana Z. Williams
, Chris Nafis
, Gil Abramovich
, Kevin Harding
, Peter J. Bednarczyk
, Henry Chen
, Glenn Bindley
, Jason McKenzie
, Balaji Ragothomachar
, Michael Dudley

Materials Science and Engineering

General Electric
Redlen Technologies
Stony Brook University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Widespread utilization of Cadmium Zinc Telluride (CZT) in nuclear radiation detectors is currently limited by the cost of high spectroscopic quality material. Yield of devices is limited by non-uniformity in the charge collection efficiency associated crystal defects that occur during synthesis. An inspection method suitable for grading CZT parts during an early stage of device manufacturing is sought. We have implemented a combination of UT and IR imaging of CZT wafers that is successful to map sub-grain boundaries, twins and tellurium inclusions greater than 10-micron diameter. However, point defects and dislocations are below the imaging resolution of the system. It is the goal of this system to study defect density in UT and IR clear areas of CZT wafers and establish an opportunity for low signature defect mapping.

Original language	English
Title of host publication	IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010
Pages	3666-3673
Number of pages	8
DOIs	https://doi.org/10.1109/NSSMIC.2010.5874497
State	Published - 2010
Event	2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010 - Knoxville, TN, United States Duration: Oct 30 2010 → Nov 6 2010

Publication series

Name	IEEE Nuclear Science Symposium Conference Record
ISSN (Print)	1095-7863

Conference

Conference	2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010
Country/Territory	United States
City	Knoxville, TN
Period	10/30/10 → 11/6/10

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10.1109/NSSMIC.2010.5874497

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Andreini, K., Tkaczyk, J. E., Zhang, T., Williams, Y. Z., Nafis, C., Abramovich, G., Harding, K., Bednarczyk, P. J., Chen, H., Bindley, G., McKenzie, J., Ragothomachar, B., & Dudley, M. (2010). Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography. In IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010 (pp. 3666-3673). Article 5874497 (IEEE Nuclear Science Symposium Conference Record). https://doi.org/10.1109/NSSMIC.2010.5874497

@inproceedings{f42cc095910e4038b74925ef45fad589,

title = "Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography",

abstract = "Widespread utilization of Cadmium Zinc Telluride (CZT) in nuclear radiation detectors is currently limited by the cost of high spectroscopic quality material. Yield of devices is limited by non-uniformity in the charge collection efficiency associated crystal defects that occur during synthesis. An inspection method suitable for grading CZT parts during an early stage of device manufacturing is sought. We have implemented a combination of UT and IR imaging of CZT wafers that is successful to map sub-grain boundaries, twins and tellurium inclusions greater than 10-micron diameter. However, point defects and dislocations are below the imaging resolution of the system. It is the goal of this system to study defect density in UT and IR clear areas of CZT wafers and establish an opportunity for low signature defect mapping.",

author = "Kristian Andreini and Tkaczyk, \{J. Eric\} and Tan Zhang and Williams, \{Yana Z.\} and Chris Nafis and Gil Abramovich and Kevin Harding and Bednarczyk, \{Peter J.\} and Henry Chen and Glenn Bindley and Jason McKenzie and Balaji Ragothomachar and Michael Dudley",

year = "2010",

doi = "10.1109/NSSMIC.2010.5874497",

language = "English",

isbn = "9781424491063",

series = "IEEE Nuclear Science Symposium Conference Record",

pages = "3666--3673",

booktitle = "IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010",

note = "2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010 ; Conference date: 30-10-2010 Through 06-11-2010",

}

Andreini, K, Tkaczyk, JE, Zhang, T, Williams, YZ, Nafis, C, Abramovich, G, Harding, K, Bednarczyk, PJ, Chen, H, Bindley, G, McKenzie, J, Ragothomachar, B & Dudley, M 2010, Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography. in IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010., 5874497, IEEE Nuclear Science Symposium Conference Record, pp. 3666-3673, 2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010, Knoxville, TN, United States, 10/30/10. https://doi.org/10.1109/NSSMIC.2010.5874497

Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography. / Andreini, Kristian; Tkaczyk, J. Eric; Zhang, Tan et al.
IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010. 2010. p. 3666-3673 5874497 (IEEE Nuclear Science Symposium Conference Record).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography

AU - Andreini, Kristian

AU - Tkaczyk, J. Eric

AU - Zhang, Tan

AU - Williams, Yana Z.

AU - Nafis, Chris

AU - Abramovich, Gil

AU - Harding, Kevin

AU - Bednarczyk, Peter J.

AU - Chen, Henry

AU - Bindley, Glenn

AU - McKenzie, Jason

AU - Ragothomachar, Balaji

AU - Dudley, Michael

PY - 2010

Y1 - 2010

N2 - Widespread utilization of Cadmium Zinc Telluride (CZT) in nuclear radiation detectors is currently limited by the cost of high spectroscopic quality material. Yield of devices is limited by non-uniformity in the charge collection efficiency associated crystal defects that occur during synthesis. An inspection method suitable for grading CZT parts during an early stage of device manufacturing is sought. We have implemented a combination of UT and IR imaging of CZT wafers that is successful to map sub-grain boundaries, twins and tellurium inclusions greater than 10-micron diameter. However, point defects and dislocations are below the imaging resolution of the system. It is the goal of this system to study defect density in UT and IR clear areas of CZT wafers and establish an opportunity for low signature defect mapping.

AB - Widespread utilization of Cadmium Zinc Telluride (CZT) in nuclear radiation detectors is currently limited by the cost of high spectroscopic quality material. Yield of devices is limited by non-uniformity in the charge collection efficiency associated crystal defects that occur during synthesis. An inspection method suitable for grading CZT parts during an early stage of device manufacturing is sought. We have implemented a combination of UT and IR imaging of CZT wafers that is successful to map sub-grain boundaries, twins and tellurium inclusions greater than 10-micron diameter. However, point defects and dislocations are below the imaging resolution of the system. It is the goal of this system to study defect density in UT and IR clear areas of CZT wafers and establish an opportunity for low signature defect mapping.

UR - https://www.scopus.com/pages/publications/79960304276

U2 - 10.1109/NSSMIC.2010.5874497

DO - 10.1109/NSSMIC.2010.5874497

M3 - Conference contribution

AN - SCOPUS:79960304276

SN - 9781424491063

T3 - IEEE Nuclear Science Symposium Conference Record

SP - 3666

EP - 3673

BT - IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010

T2 - 2010 IEEE Nuclear Science Symposium, Medical Imaging Conference, NSS/MIC 2010 and 17th International Workshop on Room-Temperature Semiconductor X-ray and Gamma-ray Detectors, RTSD 2010

Y2 - 30 October 2010 through 6 November 2010

ER -

Andreini K, Tkaczyk JE, Zhang T, Williams YZ, Nafis C, Abramovich G et al. Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography. In IEEE Nuclear Science Symposuim and Medical Imaging Conference, NSS/MIC 2010. 2010. p. 3666-3673. 5874497. (IEEE Nuclear Science Symposium Conference Record). doi: 10.1109/NSSMIC.2010.5874497

Low-signature Cadmium Zinc Telluride CZT defect inspection by IR, ultrasound, etch pit density, and x-ray topography

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