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Low temperature co-fired ceramic packaging of CMOS capacitive sensor chip towards cell viability monitoring

  • Niina Halonen
  • , Joni Kilpijärvi
  • , Maciej Sobocinski
  • , Timir Datta-Chaudhuri
  • , Antti Hassinen
  • , Someshekar B. Prakash
  • , Peter Möller
  • , Pamela Abshire
  • , Sakari Kellokumpu
  • , Anita Lloyd Spetz
  • University of Oulu
  • University of Maryland, College Park
  • Intel
  • Linköping University

Research output: Contribution to journalArticlepeer-review

16 Scopus citations

Abstract

Cell viability monitoring is an important part of biosafety evaluation for the detection of toxic effects on cells caused by nanomaterials, preferably by label-free, noninvasive, fast, and cost effective methods. These requirements can be met by monitoring cell viability with a capacitance-sensing integrated circuit (IC) microchip. The capacitance provides a measurement of the surface attachment of adherent cells as an indication of their health status. However, the moist, warm, and corrosive biological environment requires reliable packaging of the sensor chip. In this work, a second generation of low temperature co-fired ceramic (LTCC) technology was combined with flip-chip bonding to provide a durable package compatible with cell culture. The LTCC-packaged sensor chip was integrated with a printed circuit board, data acquisition device, and measurement-controlling software. The packaged sensor chip functioned well in the presence of cell medium and cells, with output voltages depending on the medium above the capacitors. Moreover, the manufacturing of microfluidic channels in the LTCC package was demonstrated.

Original languageEnglish
Pages (from-to)1871-1877
Number of pages7
JournalBeilstein Journal of Nanotechnology
Volume7
Issue number1
DOIs
StatePublished - 2016

Keywords

  • Capacitance sensing
  • Cell viability
  • Lab-on-a-chip
  • Low temperature co-fired ceramic (LTCC)

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