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Micropipe dissociation through thick n+ buffer layer growth

  • M. F. MacMillan
  • , E. Sanchez
  • , M. Dudley
  • , Yi Chen
  • , M. J. Loboda
  • Dow Chemical
  • Stony Brook University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Thick (> 25 μrn) 4H n+ epitaxial layer growth was performed on 4H n+ substrates utilizing chlorine containing etch chemistries in a hot wall CVD system. Optimization of the n+ epitaxial layer growth was achieved by varying C/Si ratio and N2 flow. Desired epitaxial layers have doping levels > 5×10 cm-3", epitaxial surface roughness <10 nm on a 20×20 μm area and overall micropipe density reduction. To confirm the conversion of micropipes into closed core screw dislocations, microscopic examination of the epitaxial and wafer surfaces was carried out after KOH etching. Grazing incidence x-ray topography (XRT) as well as cross sectional XRT and microscopy were also performed. The cross sectional evaluation showed that the dissociation of the micropipes occurs very close to the epitaxy/wafer interface.

Original languageEnglish
Title of host publicationSilicon Carbide and Related Materials 2007
EditorsAkira Suzuki, Hajime Okumura, Kenji Fukuda, Shin-ichi Nishizawa, Tsunenobu Kimoto, Takashi Fuyuki
PublisherTrans Tech Publications Ltd
Pages167-170
Number of pages4
ISBN (Print)9780878493579
DOIs
StatePublished - 2009
Event12th International Conference on Silicon Carbide and Related Materials, ICSCRM 2007 - Otsu, Japan
Duration: Oct 14 2007Oct 19 2007

Publication series

NameMaterials Science Forum
Volume600-603
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

Conference12th International Conference on Silicon Carbide and Related Materials, ICSCRM 2007
Country/TerritoryJapan
CityOtsu
Period10/14/0710/19/07

Keywords

  • KOH etch
  • Micropipe dissociation
  • XRT

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