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Monitoring fugitive methane gas emission from natural gas pads

  • Levente J. Klein
  • , Ted Van Kessel
  • , Dhruv Nair
  • , Ramachandran Muralidhar
  • , Hendrik Hamann
  • , Norma Sosa
  • IBM

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Identifying fugitive methane leaks can improve predictive maintenance of the extraction process, can extend gas extraction equipment lifetime, and eliminate hazardous work conditions. We demonstrate a wireless sensor network based on cost effective and robust chemi-resistive methane sensors combined with real time analytics to identify leaks from 2 scfh to 1000 scfh. The chemi-resistive sensors were validated to have a sensitivity better than 1 ppm in methane plume detection. The real time chemical sensor and wind data is integrated into an inversion models to identify the location and the magnitude of the methane leak. This integrated sensing and analytics solution can be deployed in outdoor environment for long term monitoring of accidental methane plume emissions, generate recommendations about fixing them, and ensure compliance with local government regulations.

Original languageEnglish
Title of host publicationASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
PublisherAmerican Society of Mechanical Engineers
ISBN (Electronic)9780791858097
DOIs
StatePublished - 2017
EventASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, United States
Duration: Aug 29 2017Sep 1 2017

Publication series

NameASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems

Conference

ConferenceASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing Systems
Country/TerritoryUnited States
CitySan Francisco
Period08/29/1709/1/17

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