TY - GEN
T1 - Novel concepts in direct writing of electronics and sensors
AU - Sampath, Sanjay
PY - 2005
Y1 - 2005
N2 - This paper outlines new capabilities in the arena of maskless direct writing of advanced materials for applications in thick film electronic circuits and sensors. The genesis of this capability lies in advanced concepts based on a thermal spray particle-based deposition technology which allows for printing of 3D conformal mesoscale components of metals, ceramics, composites and polymers onto a range of substrates at low substrate temperatures. The capabilities derived offer new approaches towards integrating structures with electronics and sensors.
AB - This paper outlines new capabilities in the arena of maskless direct writing of advanced materials for applications in thick film electronic circuits and sensors. The genesis of this capability lies in advanced concepts based on a thermal spray particle-based deposition technology which allows for printing of 3D conformal mesoscale components of metals, ceramics, composites and polymers onto a range of substrates at low substrate temperatures. The capabilities derived offer new approaches towards integrating structures with electronics and sensors.
UR - https://www.scopus.com/pages/publications/29844454122
U2 - 10.2352/issn.2169-4451.2005.21.2.art00009_3
DO - 10.2352/issn.2169-4451.2005.21.2.art00009_3
M3 - Conference contribution
AN - SCOPUS:29844454122
SN - 0892082585
SN - 9780892082582
T3 - Digital Fabrication 2005 - Final Program and Proceedings
SP - 21
EP - 24
BT - Digital Fabrication 2005 - Final Program and Proceedings
PB - Society for Imaging Science and Technology
T2 - Digital Fabrication 2005
Y2 - 18 September 2005 through 22 September 2005
ER -