Novel integration and packaging concepts of highly miniaturized inductively powered neural implants

Adam Khalifa; Yasha Karimi; Milutin Stanacevic; Ralph Etienne-Cummings

doi:10.1109/EMBC.2017.8036805

Novel integration and packaging concepts of highly miniaturized inductively powered neural implants

Adam Khalifa
, Yasha Karimi
, Milutin Stanacevic
, Ralph Etienne-Cummings

Electrical Engineering

Johns Hopkins University
Stony Brook University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

7 Scopus citations

Abstract

This work proposes solutions to the current bulky packaged neural implants. We describe the next generation of miniaturized wirelessly powered neural interface that are distributed and free floating in the nervous system. This paper focuses on the microassembly, hermetic packaging and its effect on the inductive power link.

Original language	English
Title of host publication	2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
Subtitle of host publication	Smarter Technology for a Healthier World, EMBC 2017 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	234-237
Number of pages	4
ISBN (Electronic)	9781509028092
DOIs	https://doi.org/10.1109/EMBC.2017.8036805
State	Published - Sep 13 2017
Event	39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017 - Jeju Island, Korea, Republic of Duration: Jul 11 2017 → Jul 15 2017

Publication series

Name	Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
ISSN (Print)	1557-170X

Conference

Conference	39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017
Country/Territory	Korea, Republic of
City	Jeju Island
Period	07/11/17 → 07/15/17

Access to Document

10.1109/EMBC.2017.8036805

Cite this

Khalifa, A., Karimi, Y., Stanacevic, M., & Etienne-Cummings, R. (2017). Novel integration and packaging concepts of highly miniaturized inductively powered neural implants. In 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Smarter Technology for a Healthier World, EMBC 2017 - Proceedings (pp. 234-237). Article 8036805 (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EMBC.2017.8036805

Khalifa, Adam ; Karimi, Yasha ; Stanacevic, Milutin et al. / Novel integration and packaging concepts of highly miniaturized inductively powered neural implants. 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Smarter Technology for a Healthier World, EMBC 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 234-237 (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS).

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title = "Novel integration and packaging concepts of highly miniaturized inductively powered neural implants",

abstract = "This work proposes solutions to the current bulky packaged neural implants. We describe the next generation of miniaturized wirelessly powered neural interface that are distributed and free floating in the nervous system. This paper focuses on the microassembly, hermetic packaging and its effect on the inductive power link.",

author = "Adam Khalifa and Yasha Karimi and Milutin Stanacevic and Ralph Etienne-Cummings",

note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017 ; Conference date: 11-07-2017 Through 15-07-2017",

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doi = "10.1109/EMBC.2017.8036805",

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Khalifa, A, Karimi, Y, Stanacevic, M & Etienne-Cummings, R 2017, Novel integration and packaging concepts of highly miniaturized inductively powered neural implants. in 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Smarter Technology for a Healthier World, EMBC 2017 - Proceedings., 8036805, Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS, Institute of Electrical and Electronics Engineers Inc., pp. 234-237, 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2017, Jeju Island, Korea, Republic of, 07/11/17. https://doi.org/10.1109/EMBC.2017.8036805

Novel integration and packaging concepts of highly miniaturized inductively powered neural implants. / Khalifa, Adam; Karimi, Yasha; Stanacevic, Milutin et al.
2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Smarter Technology for a Healthier World, EMBC 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. p. 234-237 8036805 (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - This work proposes solutions to the current bulky packaged neural implants. We describe the next generation of miniaturized wirelessly powered neural interface that are distributed and free floating in the nervous system. This paper focuses on the microassembly, hermetic packaging and its effect on the inductive power link.

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Khalifa A, Karimi Y, Stanacevic M, Etienne-Cummings R. Novel integration and packaging concepts of highly miniaturized inductively powered neural implants. In 2017 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society: Smarter Technology for a Healthier World, EMBC 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc. 2017. p. 234-237. 8036805. (Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS). doi: 10.1109/EMBC.2017.8036805

Novel integration and packaging concepts of highly miniaturized inductively powered neural implants

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