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Numerical studies on the frequency response of vibration of damped axially moving wire

  • Stony Brook University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The vibration response of damped axially moving wire is studied numerically in this paper for the purpose of wiresaw application. Vibration of a moving wire with damping in a slurry wiresaw system is of great interests because of its impact on the quality of the surface finish of sliced wafers and the accompanying kerf loss. The results of eigenvalues, eigenvectors, and free vibration response agree with the closed-form solution presented before. In addition, the frequency response of the system was investigated by applying point harmonic external excitation, similar to the situation with a moving wire immersed in slurry with abrasive grits. The simulation results show that the damping factor will reduce the magnitude of the response, as expected. However, the speed of the axially moving wire will shift the peak of the frequency response, which agree with the effect of apparent damping provided by the analytical solution of the system frequencies. In addition, the relationship between the nodal points of modes and the position of point excitation are also presented.

Original languageEnglish
Title of host publicationASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Pages1403-1412
Number of pages10
EditionPARTS A AND B
DOIs
StatePublished - 2009
EventASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 - San Diego, CA, United States
Duration: Aug 30 2009Sep 2 2009

Publication series

NameProceedings of the ASME Design Engineering Technical Conference
NumberPARTS A AND B
Volume1

Conference

ConferenceASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
Country/TerritoryUnited States
CitySan Diego, CA
Period08/30/0909/2/09

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