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Oligomer and random copolymer layer in relation to enhancement of interfacial adhesion at polystyrene/poly(styrene-co-acrylonitrile) interface

  • Seoul National University

Research output: Contribution to journalArticlepeer-review

5 Scopus citations

Abstract

This study examines the interfacial adhesion between poly(styrene) (PS) and poly(styrene-co-acrylonitrile) (SAN) interfaces reinforced with poly(styrene-co-vinyl phenol) (PS-ran-PSPh) random copolymers using an asymmetric double-cantilever beam (ADCB) test. The effects of oligomer and copolymer composition on interfacial adhesion were investigated. The results showed that the interfacial adhesion of the PS/SAN interface was increased significantly after removing the residual oligomer from the SAN. The interfacial adhesion was also measured for five-purified SAN materials in the range 17-31 wt%. The highest level of PS/SAN adhesion was observed for 17% AN (acrylonitrile) materials. In addition, the interfacial adhesion of a mixture of diblock and random copolymer was measured in order to investigate which is the most effective method. The results showed that mixture systems are more cost-effective with higher adhesion, which is independent of temperature. Atomic force microscopy showed that a single craze ahead of the crack is a possible failure mode during PS/SAN interface fracture.

Original languageEnglish
Pages (from-to)287-293
Number of pages7
JournalPolymer International
Volume53
Issue number3
DOIs
StatePublished - Mar 2004

Keywords

  • Block copolymer
  • Immiscible polymer joints
  • Interfacial adhesion
  • Interfacial layer
  • Oligomer
  • Random copolymer

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