TY - GEN
T1 - Optimization algorithms for energy-efficient data centers
AU - Hamann, Hendrik F.
PY - 2013
Y1 - 2013
N2 - Real-time optimization algorithms for managing energy efficiency in data centers have been developed and implemented. For example, for a given cooling configuration (which is being measured and modeled in real-time using IBM's Measurement and Management Technologies) an optimization algorithm allows identifying the optimum placement of new servers (or workloads) or alternatively where to remove servers (or workload) for different constraints. Another optimization algorithm optimizes performance of the data center without creating hotspots. The optimization algorithms use a physical model in junction with linear programming as well as linear least square methods.
AB - Real-time optimization algorithms for managing energy efficiency in data centers have been developed and implemented. For example, for a given cooling configuration (which is being measured and modeled in real-time using IBM's Measurement and Management Technologies) an optimization algorithm allows identifying the optimum placement of new servers (or workloads) or alternatively where to remove servers (or workload) for different constraints. Another optimization algorithm optimizes performance of the data center without creating hotspots. The optimization algorithms use a physical model in junction with linear programming as well as linear least square methods.
UR - https://www.scopus.com/pages/publications/84894659926
U2 - 10.1115/IPACK2013-73066
DO - 10.1115/IPACK2013-73066
M3 - Conference contribution
AN - SCOPUS:84894659926
SN - 9780791855768
T3 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
BT - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
T2 - ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Y2 - 16 July 2013 through 18 July 2013
ER -