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Partial discharge testing platform for high voltage power module packaging under square wave excitation

  • Yalin Wang
  • , Zhao Yuan
  • , Hongwu Peng
  • , Yi Ding
  • , Yi Yin
  • , Luo Fang
  • Shanghai Jiao Tong University
  • University of Arkansas, Fayetteville
  • University of Connecticut

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

17 Scopus citations

Abstract

Partial discharge (PD) issue of high voltage power module packaging insulation is increasingly critical due to the development of high voltage wide bandgap power modules towards high power density, which leads to smaller packages and higher operating voltages. However, existing standards for high voltage power modules focus on PD measurement under the sinusoidal waveform rather than actual DC or square waveform that poses actual electric stress on packaging insulation, and thus cannot fully represent the PD phenomenon in power electronics systems. To bridge this gap, this paper introduces a PD testing platform trimmed for high voltage power electronics systems, including a high-voltage (10 kV) square wave generator using supercascode structure with off-shelf SiC devices, and a contactless PD monitor using Super High Frequency (SHF) signatures from the PD event. The challenges in the design of this platform include the development of a PD-free high voltage square wave generator, and SHF PD signature separation from EMI noises induced by high dV/dt switching actions. Experiment validation is included in the last section of this paper.

Original languageEnglish
Title of host publication2021 IEEE Applied Power Electronics Conference and Exposition, APEC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1491-1495
Number of pages5
ISBN (Electronic)9781728189499
DOIs
StatePublished - Jun 14 2021
Event36th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2021 - Virtual, Online, United States
Duration: Jun 14 2021Jun 17 2021

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Conference

Conference36th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period06/14/2106/17/21

Keywords

  • Packaging insulation
  • Partial Discharge
  • Power module
  • Super high frequency

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