Rapid three-dimensional thermal characterization of large-scale computing facilities

Hendrick F. Hamann; James A. Lacey; Martin O'Boyle; Roger R. Schmidt; Madhusudan Iyengar

doi:10.1109/TCAPT.2008.923629

Rapid three-dimensional thermal characterization of large-scale computing facilities

Hendrick F. Hamann
, James A. Lacey
, Martin O'Boyle
, Roger R. Schmidt
, Madhusudan Iyengar

Office of the Dean SOMAS

IBM

Research output: Contribution to journal › Article › peer-review

31 Scopus citations

Abstract

We demonstrate a mobile measurement technology which allows for fast and systematic 3-D temperature mapping of data centers. This technology yields the first experimental 3-D temperature images of an actual data center. The experimental temperature distributions reveal strong hot spots in the data center suggesting that current cooling schemes can be readily improved.

Original language	English
Pages (from-to)	444-448
Number of pages	5
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	31
Issue number	2 SPEC. ISS.
DOIs	https://doi.org/10.1109/TCAPT.2008.923629
State	Published - 2008

Keywords

Computational fluid dynamic (CFD)
Data center
Mobile measurement technology (MMT)
Thermal management

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10.1109/TCAPT.2008.923629

Cite this

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title = "Rapid three-dimensional thermal characterization of large-scale computing facilities",

abstract = "We demonstrate a mobile measurement technology which allows for fast and systematic 3-D temperature mapping of data centers. This technology yields the first experimental 3-D temperature images of an actual data center. The experimental temperature distributions reveal strong hot spots in the data center suggesting that current cooling schemes can be readily improved.",

keywords = "Computational fluid dynamic (CFD), Data center, Mobile measurement technology (MMT), Thermal management",

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AU - Hamann, Hendrick F.

AU - Lacey, James A.

AU - O'Boyle, Martin

AU - Schmidt, Roger R.

AU - Iyengar, Madhusudan

PY - 2008

Y1 - 2008

N2 - We demonstrate a mobile measurement technology which allows for fast and systematic 3-D temperature mapping of data centers. This technology yields the first experimental 3-D temperature images of an actual data center. The experimental temperature distributions reveal strong hot spots in the data center suggesting that current cooling schemes can be readily improved.

AB - We demonstrate a mobile measurement technology which allows for fast and systematic 3-D temperature mapping of data centers. This technology yields the first experimental 3-D temperature images of an actual data center. The experimental temperature distributions reveal strong hot spots in the data center suggesting that current cooling schemes can be readily improved.

KW - Computational fluid dynamic (CFD)

KW - Data center

KW - Mobile measurement technology (MMT)

KW - Thermal management

UR - https://www.scopus.com/pages/publications/65349183123

U2 - 10.1109/TCAPT.2008.923629

DO - 10.1109/TCAPT.2008.923629

M3 - Article

AN - SCOPUS:65349183123

SN - 1521-3331

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EP - 448

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 2 SPEC. ISS.

ER -

Rapid three-dimensional thermal characterization of large-scale computing facilities

Abstract

Keywords

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