TY - GEN
T1 - Reduced-order modeling framework for improving spatial resolution of data center transient air temperatures
AU - Ghosh, Rajat
AU - Joshi, Yogendra
AU - Klein, Levente
AU - Hamann, Hendrik
PY - 2013
Y1 - 2013
N2 - A proper orthogonal decomposition (POD)-based modeling framework is developed for improving the spatial resolution of transient rack air temperature data collected in a heterogeneous data center (DC) facility. Blocking cooling air inflow into racks periodically, three sets of transient temperature data are collected at the outlets of electronic equipment residing in three different racks. Using various combinations of initial discrete data as ensembles, the capability of the proposed POD/ interpolation framework for predicting new temperature data is demonstrated. The accuracy of POD-based temperature predictions is validated by comparing it to corresponding experimental data. The root mean square deviations between experimental data and POD-based predictions are found to be on the order of 5%.
AB - A proper orthogonal decomposition (POD)-based modeling framework is developed for improving the spatial resolution of transient rack air temperature data collected in a heterogeneous data center (DC) facility. Blocking cooling air inflow into racks periodically, three sets of transient temperature data are collected at the outlets of electronic equipment residing in three different racks. Using various combinations of initial discrete data as ensembles, the capability of the proposed POD/ interpolation framework for predicting new temperature data is demonstrated. The accuracy of POD-based temperature predictions is validated by comparing it to corresponding experimental data. The root mean square deviations between experimental data and POD-based predictions are found to be on the order of 5%.
KW - Data center
KW - dynamic events
KW - proper orthogonal decomposition
KW - transient temperature measurement
UR - https://www.scopus.com/pages/publications/84880759876
U2 - 10.1109/SEMI-THERM.2013.6526832
DO - 10.1109/SEMI-THERM.2013.6526832
M3 - Conference contribution
AN - SCOPUS:84880759876
SN - 9781467364294
T3 - Annual IEEE Semiconductor Thermal Measurement and Management Symposium
SP - 216
EP - 222
BT - 29th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2013 - Proceedings
T2 - 29th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, SEMI-THERM 2013
Y2 - 17 March 2013 through 21 March 2013
ER -