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Reduced order thermal modeling of data centers via distributed sensor data

  • Emad Samadiani
  • , Madhusudan K. Iyengar
  • , Yogendra Joshi
  • , Steven Kamalsy
  • , Hendrik Hamann
  • , James Lacey
  • Georgia Institute of Technology
  • IBM

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

11 Scopus citations

Abstract

In this paper, an effective and computationally efficient Proper Orthogonal Decomposition (POD) based reduced order modeling approach is presented, which utilizes selected sets of observed thermal sensor data inside the data centers to help predict the data center temperature field as a function of the air flow rates of Computer Room Air Conditioning (CRAC) units. The approach is demonstrated through application to an operational data center of 102.2 m 2 (1,100 square feet) with a hot and cold aisle arrangement of racks cooled by one CRAC unit. While the thermal data throughout the facility can be collected in about 30 minutes using a 3D temperature mapping tool, the POD method is able to generate temperature field throughout the data center in less than 2 seconds on a high end desktop PC. Comparing the obtained POD temperature fields with the experimentally measured data for two different values of CRAC flow rates shows that the method can predict the temperature field with the average error of 0.68°C or 3.2%.

Original languageEnglish
Title of host publicationProceedings of the ASME InterPack Conference 2009, IPACK2009
Pages807-814
Number of pages8
DOIs
StatePublished - 2010
Event2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States
Duration: Jul 19 2009Jul 23 2009

Publication series

NameProceedings of the ASME InterPack Conference 2009, IPACK2009
Volume2

Conference

Conference2009 ASME InterPack Conference, IPACK2009
Country/TerritoryUnited States
CitySan Francisco, CA
Period07/19/0907/23/09

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