Results from the first prototype of large 3D active edge sensors

Angela Kok; M. Boscardin; G. F. Dalla Betta; C. Da Via'; G. Darbo; C. Fleta; T. E. Hansen; J. Hasi; C. Kenney; N. Lietaer; M. Lozano; S. I. Parker; G. Pellegrini; A. Summanwar

doi:10.1109/NSSMIC.2011.6154334

Results from the first prototype of large 3D active edge sensors

Angela Kok
, M. Boscardin
, G. F. Dalla Betta
, C. Da Via'
, G. Darbo
, C. Fleta
, T. E. Hansen
, J. Hasi
, C. Kenney
, N. Lietaer
, M. Lozano
, S. I. Parker
, G. Pellegrini
, A. Summanwar

Physics and Astronomy

SINTEF
Fondazione Bruno Kessler
University of Trento
National Institute for Nuclear Physics
Centro Nacional de Microelectrónica (IMB-CNM-CSIC)
SLAC National Accelerator Laboratory
University of Hawai'i at Mānoa

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

6 Scopus citations

Abstract

3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm² 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.

Original language	English
Title of host publication	2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1319-1323
Number of pages	5
ISBN (Print)	9781467301183
DOIs	https://doi.org/10.1109/NSSMIC.2011.6154334
State	Published - 2011
Event	2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011 - Valencia, Spain Duration: Oct 23 2011 → Oct 29 2011

Publication series

Name	IEEE Nuclear Science Symposium Conference Record
ISSN (Print)	1095-7863

Conference

Conference	2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011
Country/Territory	Spain
City	Valencia
Period	10/23/11 → 10/29/11

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10.1109/NSSMIC.2011.6154334

Cite this

Kok, A., Boscardin, M., Dalla Betta, G. F., Da Via', C., Darbo, G., Fleta, C., Hansen, T. E., Hasi, J., Kenney, C., Lietaer, N., Lozano, M., Parker, S. I., Pellegrini, G., & Summanwar, A. (2011). Results from the first prototype of large 3D active edge sensors. In 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011 (pp. 1319-1323). Article 6154334 (IEEE Nuclear Science Symposium Conference Record). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NSSMIC.2011.6154334

@inproceedings{3db8d24edffb476785080756b5607edc,

title = "Results from the first prototype of large 3D active edge sensors",

abstract = "3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.",

author = "Angela Kok and M. Boscardin and \{Dalla Betta\}, \{G. F.\} and \{Da Via'\}, C. and G. Darbo and C. Fleta and Hansen, \{T. E.\} and J. Hasi and C. Kenney and N. Lietaer and M. Lozano and Parker, \{S. I.\} and G. Pellegrini and A. Summanwar",

year = "2011",

doi = "10.1109/NSSMIC.2011.6154334",

language = "English",

isbn = "9781467301183",

series = "IEEE Nuclear Science Symposium Conference Record",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "1319--1323",

booktitle = "2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011",

note = "2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011 ; Conference date: 23-10-2011 Through 29-10-2011",

}

Kok, A, Boscardin, M, Dalla Betta, GF, Da Via', C, Darbo, G, Fleta, C, Hansen, TE, Hasi, J, Kenney, C, Lietaer, N, Lozano, M, Parker, SI, Pellegrini, G & Summanwar, A 2011, Results from the first prototype of large 3D active edge sensors. in 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011., 6154334, IEEE Nuclear Science Symposium Conference Record, Institute of Electrical and Electronics Engineers Inc., pp. 1319-1323, 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011, Valencia, Spain, 10/23/11. https://doi.org/10.1109/NSSMIC.2011.6154334

Results from the first prototype of large 3D active edge sensors. / Kok, Angela; Boscardin, M.; Dalla Betta, G. F. et al.
2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011. Institute of Electrical and Electronics Engineers Inc., 2011. p. 1319-1323 6154334 (IEEE Nuclear Science Symposium Conference Record).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Results from the first prototype of large 3D active edge sensors

AU - Kok, Angela

AU - Boscardin, M.

AU - Dalla Betta, G. F.

AU - Da Via', C.

AU - Darbo, G.

AU - Fleta, C.

AU - Hansen, T. E.

AU - Hasi, J.

AU - Kenney, C.

AU - Lietaer, N.

AU - Lozano, M.

AU - Parker, S. I.

AU - Pellegrini, G.

AU - Summanwar, A.

PY - 2011

Y1 - 2011

N2 - 3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.

AB - 3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.

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U2 - 10.1109/NSSMIC.2011.6154334

DO - 10.1109/NSSMIC.2011.6154334

M3 - Conference contribution

AN - SCOPUS:84858635344

SN - 9781467301183

T3 - IEEE Nuclear Science Symposium Conference Record

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BT - 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011

Y2 - 23 October 2011 through 29 October 2011

ER -

Kok A, Boscardin M, Dalla Betta GF, Da Via' C, Darbo G, Fleta C et al. Results from the first prototype of large 3D active edge sensors. In 2011 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2011. Institute of Electrical and Electronics Engineers Inc. 2011. p. 1319-1323. 6154334. (IEEE Nuclear Science Symposium Conference Record). doi: 10.1109/NSSMIC.2011.6154334

Results from the first prototype of large 3D active edge sensors

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