TY - GEN
T1 - Rethinking TCP throughput and latency modeling
AU - Cao, Yi
AU - Balasubramanian, Aruna
AU - Gandhi, Anshul
N1 - Publisher Copyright:
© 2017 ACM.
PY - 2017/8/22
Y1 - 2017/8/22
N2 - TCP throughput and latency models are useful tools to characterize the TCP performance. The canonical throughput model [2], while useful, has some limitations since it does not consider how packet loss rate changes over time. This approach leads to poor predictions for short flows. We present a new modeling approach that characterizes the throughput and latency models by: (i) discovering the relationship between the packet loss rate and the congestion window size, and (ii) incorporating the starting congestion window and the number of parallel connections. Experimental results show that our models significantly improve modeling accuracy.
AB - TCP throughput and latency models are useful tools to characterize the TCP performance. The canonical throughput model [2], while useful, has some limitations since it does not consider how packet loss rate changes over time. This approach leads to poor predictions for short flows. We present a new modeling approach that characterizes the throughput and latency models by: (i) discovering the relationship between the packet loss rate and the congestion window size, and (ii) incorporating the starting congestion window and the number of parallel connections. Experimental results show that our models significantly improve modeling accuracy.
KW - Network measurements
KW - Transport layer protocols
UR - https://www.scopus.com/pages/publications/85029714500
U2 - 10.1145/3123878.3131995
DO - 10.1145/3123878.3131995
M3 - Conference contribution
AN - SCOPUS:85029714500
T3 - SIGCOMM Posters and Demos 2017 - Proceedings of the 2017 SIGCOMM Posters and Demos, Part of SIGCOMM 2017
SP - 85
EP - 87
BT - SIGCOMM Posters and Demos 2017 - Proceedings of the 2017 SIGCOMM Posters and Demos, Part of SIGCOMM 2017
PB - Association for Computing Machinery
T2 - 2017 SIGCOMM Posters and Demos, SIGCOMM Posters and Demos 2017 Part of SIGCOMM 2017
Y2 - 22 August 2017 through 24 August 2017
ER -