Round-Robin studies of two potential Seebeck coefficient standard reference materials

Nathan D. Lowhorn; W. Wong-Ng; W. Zhang; Z. Q. Lu; M. Otani; E. Thomas; M. Green; T. N. Tran; N. Dilley; N. Eisner; T. Hogan; Q. Li; H. Obara; J. Sharp; R. Venkatasubramanian; R. Willigan; J. Yang; G. Nolas; T. Tritt

doi:10.1109/ICT.2007.4569495

Round-Robin studies of two potential Seebeck coefficient standard reference materials

Nathan D. Lowhorn
, W. Wong-Ng
, W. Zhang
, Z. Q. Lu
, M. Otani
, E. Thomas
, M. Green
, T. N. Tran
, N. Dilley
, N. Eisner
, T. Hogan
, Q. Li
, H. Obara
, J. Sharp
, R. Venkatasubramanian
, R. Willigan
, J. Yang
, G. Nolas
, T. Tritt

Physics and Astronomy

National Institute of Standards and Technology
Naval Surface Warfare Center
Quantum Design
Hi-Z Technology, Inc.
Michigan State University
National Institute of Advanced Industrial Science and Technology
Marlow Industries, Inc.
RTI International
United Technologies
General Motors
University of South Florida
Clemson University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

The scientific activities of NIST include the development and distribution of standard reference materials (SRM™) for instrument calibration and inter-laboratory data comparison. Full characterization of a thermoelectric material requires measurement of the electrical resistivity, thermal conductivity, and Seebeck coefficient. While standard reference materials exist or have existed for the first two properties, Seebeck coefficient standard reference materials are not available. In an effort to expedite research efforts in this field, we have initiated a project to develop a Seebeck coefficient SRM™ material. Currently, we have completed a round-robin measurement survey of two candidate materials, Bi₂Te₃ and constantan (55% Cu and 45% Ni). In this paper, we summarize our plan and development effort, including the results and the methodology used for the round-robin measurement survey.

Original language	English
Title of host publication	Proceedings ICT'07 - 26th International Conference on Thermoelectrics
Pages	361-365
Number of pages	5
DOIs	https://doi.org/10.1109/ICT.2007.4569495
State	Published - 2007
Event	ICT'07 - 26th International Conference on Thermoelectrics - Jeju, Korea, Republic of Duration: Jun 3 2007 → Jun 7 2007

Publication series

Name	International Conference on Thermoelectrics, ICT, Proceedings

Conference

Conference	ICT'07 - 26th International Conference on Thermoelectrics
Country/Territory	Korea, Republic of
City	Jeju
Period	06/3/07 → 06/7/07

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10.1109/ICT.2007.4569495

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Lowhorn, N. D., Wong-Ng, W., Zhang, W., Lu, Z. Q., Otani, M., Thomas, E., Green, M., Tran, T. N., Dilley, N., Eisner, N., Hogan, T., Li, Q., Obara, H., Sharp, J., Venkatasubramanian, R., Willigan, R., Yang, J., Nolas, G., & Tritt, T. (2007). Round-Robin studies of two potential Seebeck coefficient standard reference materials. In Proceedings ICT'07 - 26th International Conference on Thermoelectrics (pp. 361-365). Article 4569495 (International Conference on Thermoelectrics, ICT, Proceedings). https://doi.org/10.1109/ICT.2007.4569495

@inproceedings{af59f55caad948259f715bce38779c45,

title = "Round-Robin studies of two potential Seebeck coefficient standard reference materials",

abstract = "The scientific activities of NIST include the development and distribution of standard reference materials (SRM{\texttrademark}) for instrument calibration and inter-laboratory data comparison. Full characterization of a thermoelectric material requires measurement of the electrical resistivity, thermal conductivity, and Seebeck coefficient. While standard reference materials exist or have existed for the first two properties, Seebeck coefficient standard reference materials are not available. In an effort to expedite research efforts in this field, we have initiated a project to develop a Seebeck coefficient SRM{\texttrademark} material. Currently, we have completed a round-robin measurement survey of two candidate materials, Bi2Te3 and constantan (55\% Cu and 45\% Ni). In this paper, we summarize our plan and development effort, including the results and the methodology used for the round-robin measurement survey.",

author = "Lowhorn, \{Nathan D.\} and W. Wong-Ng and W. Zhang and Lu, \{Z. Q.\} and M. Otani and E. Thomas and M. Green and Tran, \{T. N.\} and N. Dilley and N. Eisner and T. Hogan and Q. Li and H. Obara and J. Sharp and R. Venkatasubramanian and R. Willigan and J. Yang and G. Nolas and T. Tritt",

year = "2007",

doi = "10.1109/ICT.2007.4569495",

language = "English",

isbn = "9781424422623",

series = "International Conference on Thermoelectrics, ICT, Proceedings",

pages = "361--365",

booktitle = "Proceedings ICT'07 - 26th International Conference on Thermoelectrics",

note = "ICT'07 - 26th International Conference on Thermoelectrics ; Conference date: 03-06-2007 Through 07-06-2007",

}

Lowhorn, ND, Wong-Ng, W, Zhang, W, Lu, ZQ, Otani, M, Thomas, E, Green, M, Tran, TN, Dilley, N, Eisner, N, Hogan, T, Li, Q, Obara, H, Sharp, J, Venkatasubramanian, R, Willigan, R, Yang, J, Nolas, G & Tritt, T 2007, Round-Robin studies of two potential Seebeck coefficient standard reference materials. in Proceedings ICT'07 - 26th International Conference on Thermoelectrics., 4569495, International Conference on Thermoelectrics, ICT, Proceedings, pp. 361-365, ICT'07 - 26th International Conference on Thermoelectrics, Jeju, Korea, Republic of, 06/3/07. https://doi.org/10.1109/ICT.2007.4569495

Round-Robin studies of two potential Seebeck coefficient standard reference materials. / Lowhorn, Nathan D.; Wong-Ng, W.; Zhang, W. et al.
Proceedings ICT'07 - 26th International Conference on Thermoelectrics. 2007. p. 361-365 4569495 (International Conference on Thermoelectrics, ICT, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Round-Robin studies of two potential Seebeck coefficient standard reference materials

AU - Lowhorn, Nathan D.

AU - Wong-Ng, W.

AU - Zhang, W.

AU - Lu, Z. Q.

AU - Otani, M.

AU - Thomas, E.

AU - Green, M.

AU - Tran, T. N.

AU - Dilley, N.

AU - Eisner, N.

AU - Hogan, T.

AU - Li, Q.

AU - Obara, H.

AU - Sharp, J.

AU - Venkatasubramanian, R.

AU - Willigan, R.

AU - Yang, J.

AU - Nolas, G.

AU - Tritt, T.

PY - 2007

Y1 - 2007

N2 - The scientific activities of NIST include the development and distribution of standard reference materials (SRM™) for instrument calibration and inter-laboratory data comparison. Full characterization of a thermoelectric material requires measurement of the electrical resistivity, thermal conductivity, and Seebeck coefficient. While standard reference materials exist or have existed for the first two properties, Seebeck coefficient standard reference materials are not available. In an effort to expedite research efforts in this field, we have initiated a project to develop a Seebeck coefficient SRM™ material. Currently, we have completed a round-robin measurement survey of two candidate materials, Bi2Te3 and constantan (55% Cu and 45% Ni). In this paper, we summarize our plan and development effort, including the results and the methodology used for the round-robin measurement survey.

AB - The scientific activities of NIST include the development and distribution of standard reference materials (SRM™) for instrument calibration and inter-laboratory data comparison. Full characterization of a thermoelectric material requires measurement of the electrical resistivity, thermal conductivity, and Seebeck coefficient. While standard reference materials exist or have existed for the first two properties, Seebeck coefficient standard reference materials are not available. In an effort to expedite research efforts in this field, we have initiated a project to develop a Seebeck coefficient SRM™ material. Currently, we have completed a round-robin measurement survey of two candidate materials, Bi2Te3 and constantan (55% Cu and 45% Ni). In this paper, we summarize our plan and development effort, including the results and the methodology used for the round-robin measurement survey.

UR - https://www.scopus.com/pages/publications/51849146603

U2 - 10.1109/ICT.2007.4569495

DO - 10.1109/ICT.2007.4569495

M3 - Conference contribution

AN - SCOPUS:51849146603

SN - 9781424422623

T3 - International Conference on Thermoelectrics, ICT, Proceedings

SP - 361

EP - 365

BT - Proceedings ICT'07 - 26th International Conference on Thermoelectrics

T2 - ICT'07 - 26th International Conference on Thermoelectrics

Y2 - 3 June 2007 through 7 June 2007

ER -

Round-Robin studies of two potential Seebeck coefficient standard reference materials

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