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Sensor response and radiation damage effects for 3D pixels in the ATLAS IBL Detector

  • The ATLAS collaboration
  • Aix-Marseille Université
  • University of Bergen
  • University of Oklahoma
  • New York University Abu Dhabi
  • University of Göttingen
  • TU Dortmund University
  • United States Department of Energy
  • Southern Methodist University
  • Mohammed V University in Rabat
  • Tel Aviv University
  • Technion-Israel Institute of Technology
  • New York University
  • National Institute for Nuclear Physics
  • Abdus Salam International Centre for Theoretical Physics
  • King's College London
  • Heidelberg University 
  • Université Savoie Mont Blanc
  • AGH University of Krakow
  • Brandeis University
  • University of Manchester
  • Northern Illinois University
  • Istanbul University
  • Rutherford Appleton Laboratory
  • University of California at Santa Cruz
  • The University of Chicago
  • Institute for High Energy Physics
  • University of Pavia
  • Johannes Gutenberg University Mainz
  • Alexandru Ioan Cuza University of Iaşi
  • Azerbaijan National Academy of Sciences
  • CERN
  • McGill University
  • Royal Holloway University of London
  • Zhengzhou University
  • University of Rome Tor Vergata
  • University of Valencia
  • University of Hassan II Casablanca
  • Lund University
  • Waseda University
  • University of Bonn
  • Bogazici University
  • Columbia University
  • University of Victoria BC

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

Pixel sensors in 3D technology equip the outer ends of the staves of the Insertable B Layer (IBL), the innermost layer of the ATLAS Pixel Detector, which was installed before the start of LHC Run 2 in 2015. 3D pixel sensors are expected to exhibit more tolerance to radiation damage and are the technology of choice for the innermost layer in the ATLAS tracker upgrade for the HL-LHC programme. While the LHC has delivered an integrated luminosity of ≃ 235 fb−1 since the start of Run 2, the 3D sensors have received a non-ionising energy deposition corresponding to a fluence of ≃ 8.5 × 1014 1 MeV neutron-equivalent cm−2 averaged over the sensor area. This paper presents results of measurements of the 3D pixel sensors’ response during Run 2 and the first two years of Run 3, with predictions of its evolution until the end of Run 3 in 2025. Data are compared with radiation damage simulations, based on detailed maps of the electric field in the Si substrate, at various fluence levels and bias voltage values. These results illustrate the potential of 3D technology for pixel applications in high-radiation environments.

Original languageEnglish
JournalJournal of Instrumentation
Volume19
Issue number10
DOIs
StatePublished - Oct 1 2024

Keywords

  • charge transport
  • Detector modelling and simulations II (electric fields
  • electron emission
  • etc); Particle tracking detectors (Solid-state detectors)
  • multiplication and induction
  • pulse formation

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