TY - GEN
T1 - Silicon Device-Based Sensing for Sustainability
AU - Zafar, S.
AU - Picunko, T.
AU - Cabral, C.
AU - Hopstaken, Marinus
AU - Solomon, P.
AU - Hamann, H. F.
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - Sustainable agriculture can address two interlinked global challenges of climate change and food security. However, sustainable agricultural practices are limited by the lack of inground chemical sensors for soil [1]. This limitation occurs because reference electrodes (RE) of electronic sensors fail when inserted in soil. To overcome this limitation, an innovative RE has been proposed, validated, and extensively evaluated in soil. It is also integrated into a manufacturable silicon device-based sensing portable prototype, thus advancing inground sensor technology for sustainability.
AB - Sustainable agriculture can address two interlinked global challenges of climate change and food security. However, sustainable agricultural practices are limited by the lack of inground chemical sensors for soil [1]. This limitation occurs because reference electrodes (RE) of electronic sensors fail when inserted in soil. To overcome this limitation, an innovative RE has been proposed, validated, and extensively evaluated in soil. It is also integrated into a manufacturable silicon device-based sensing portable prototype, thus advancing inground sensor technology for sustainability.
UR - https://www.scopus.com/pages/publications/85185569558
U2 - 10.1109/IEDM45741.2023.10413816
DO - 10.1109/IEDM45741.2023.10413816
M3 - Conference contribution
AN - SCOPUS:85185569558
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2023 International Electron Devices Meeting, IEDM 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2023 International Electron Devices Meeting, IEDM 2023
Y2 - 9 December 2023 through 13 December 2023
ER -