TY - GEN
T1 - Spatially-resolved imaging of microprocessor power (SIMP)
T2 - 10th Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
AU - Hamann, Hendrik F.
AU - Lacey, James
AU - Weger, Alan
AU - Wakil, Jamil
PY - 2006
Y1 - 2006
N2 - In this paper we present the details of a new technique, which allows for spatially-resolved imaging of microprocessor power (SIMP) under full operational conditions. The method involves two steps: In the first step it utilizes infra-red (IR) thermal imaging, while an IR-transparent coolant flows through a specially designed cooling cell directly over the microprocessor. In the second step the underlying power distribution is derived by determining the temperature fields for each individual power source on the chip. The measured chip temperature distribution is then represented as a superposition of these temperature fields. The SIMP data reveals significant temporal and spatial variations of the microprocessor power/temperature distribution, which can be attributed to the circuit layout as well as to the varying utilization levels across the processor while running real workloads. More specifically, strong non-uniformities or hotspots in the microprocessor power distributions are observed, which have significant implications for packaging and cooling designs.
AB - In this paper we present the details of a new technique, which allows for spatially-resolved imaging of microprocessor power (SIMP) under full operational conditions. The method involves two steps: In the first step it utilizes infra-red (IR) thermal imaging, while an IR-transparent coolant flows through a specially designed cooling cell directly over the microprocessor. In the second step the underlying power distribution is derived by determining the temperature fields for each individual power source on the chip. The measured chip temperature distribution is then represented as a superposition of these temperature fields. The SIMP data reveals significant temporal and spatial variations of the microprocessor power/temperature distribution, which can be attributed to the circuit layout as well as to the varying utilization levels across the processor while running real workloads. More specifically, strong non-uniformities or hotspots in the microprocessor power distributions are observed, which have significant implications for packaging and cooling designs.
KW - High power density chips
KW - Hotspots
KW - Microprocessor power
KW - Package design
KW - Thermal management
UR - https://www.scopus.com/pages/publications/33845598306
U2 - 10.1109/ITHERM.2006.1645331
DO - 10.1109/ITHERM.2006.1645331
M3 - Conference contribution
AN - SCOPUS:33845598306
SN - 0780395247
SN - 9780780395244
T3 - Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
SP - 121
EP - 125
BT - Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena and Emerging Technologies in Electronic Systems, ITherm 2006
Y2 - 30 May 2006 through 2 June 2006
ER -