Spectroscopy with a novel silicon structure

Dann Nick; Da Via Cinzia; Munoz Sanchez Francisca

doi:10.1109/NSSMIC.2015.7581883

Spectroscopy with a novel silicon structure

Dann Nick
, Da Via Cinzia
, Munoz Sanchez Francisca

Physics and Astronomy

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Radiation-hard detectors are needed for the High-Luminosity upgrade for the ATLAS experiment at the Large Hadron Collider at CERN. 3D silicon devices are a technology which may be able to provide the required resolution and durability when exposed to ionising radiation. 3D sensors have electrodes processed inside the silicon bulk rather than being implanted on its surface. This paper will present a comparison of the performances of 3D and planar silicon sensors, both connected to pixel-based TimePix readout chips. The 3D detector was found to have less charge sharing and to operate at a lower bias voltage than the planar detector, due to the smaller electrode separation in the latter.

Original language	English
Title of host publication	2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781467398626
DOIs	https://doi.org/10.1109/NSSMIC.2015.7581883
State	Published - Oct 3 2016
Event	2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015 - San Diego, United States Duration: Oct 31 2015 → Nov 7 2015

Publication series

Name	2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015

Conference

Conference	2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015
Country/Territory	United States
City	San Diego
Period	10/31/15 → 11/7/15

Access to Document

10.1109/NSSMIC.2015.7581883

Cite this

Nick, D., Cinzia, D. V., & Francisca, M. S. (2016). Spectroscopy with a novel silicon structure. In 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015 Article 7581883 (2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NSSMIC.2015.7581883

@inproceedings{33586726f2644bc9b2677ab743a5c49b,

title = "Spectroscopy with a novel silicon structure",

abstract = "Radiation-hard detectors are needed for the High-Luminosity upgrade for the ATLAS experiment at the Large Hadron Collider at CERN. 3D silicon devices are a technology which may be able to provide the required resolution and durability when exposed to ionising radiation. 3D sensors have electrodes processed inside the silicon bulk rather than being implanted on its surface. This paper will present a comparison of the performances of 3D and planar silicon sensors, both connected to pixel-based TimePix readout chips. The 3D detector was found to have less charge sharing and to operate at a lower bias voltage than the planar detector, due to the smaller electrode separation in the latter.",

author = "Dann Nick and Cinzia, \{Da Via\} and Francisca, \{Munoz Sanchez\}",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015 ; Conference date: 31-10-2015 Through 07-11-2015",

year = "2016",

month = oct,

day = "3",

doi = "10.1109/NSSMIC.2015.7581883",

language = "English",

series = "2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015",

}

Nick, D, Cinzia, DV & Francisca, MS 2016, Spectroscopy with a novel silicon structure. in 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015., 7581883, 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015, Institute of Electrical and Electronics Engineers Inc., 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015, San Diego, United States, 10/31/15. https://doi.org/10.1109/NSSMIC.2015.7581883

Spectroscopy with a novel silicon structure. / Nick, Dann; Cinzia, Da Via; Francisca, Munoz Sanchez.
2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015. Institute of Electrical and Electronics Engineers Inc., 2016. 7581883 (2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Spectroscopy with a novel silicon structure

AU - Nick, Dann

AU - Cinzia, Da Via

AU - Francisca, Munoz Sanchez

PY - 2016/10/3

Y1 - 2016/10/3

N2 - Radiation-hard detectors are needed for the High-Luminosity upgrade for the ATLAS experiment at the Large Hadron Collider at CERN. 3D silicon devices are a technology which may be able to provide the required resolution and durability when exposed to ionising radiation. 3D sensors have electrodes processed inside the silicon bulk rather than being implanted on its surface. This paper will present a comparison of the performances of 3D and planar silicon sensors, both connected to pixel-based TimePix readout chips. The 3D detector was found to have less charge sharing and to operate at a lower bias voltage than the planar detector, due to the smaller electrode separation in the latter.

AB - Radiation-hard detectors are needed for the High-Luminosity upgrade for the ATLAS experiment at the Large Hadron Collider at CERN. 3D silicon devices are a technology which may be able to provide the required resolution and durability when exposed to ionising radiation. 3D sensors have electrodes processed inside the silicon bulk rather than being implanted on its surface. This paper will present a comparison of the performances of 3D and planar silicon sensors, both connected to pixel-based TimePix readout chips. The 3D detector was found to have less charge sharing and to operate at a lower bias voltage than the planar detector, due to the smaller electrode separation in the latter.

UR - https://www.scopus.com/pages/publications/84994131580

U2 - 10.1109/NSSMIC.2015.7581883

DO - 10.1109/NSSMIC.2015.7581883

M3 - Conference contribution

AN - SCOPUS:84994131580

T3 - 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015

BT - 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 IEEE Nuclear Science Symposium and Medical Imaging Conference, NSS/MIC 2015

Y2 - 31 October 2015 through 7 November 2015

ER -

Spectroscopy with a novel silicon structure

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this