Abstract
Silicon carbide (SiC) power modules have been demonstrated potential for improving power density and efficiency for low-voltage (LV) power electronics systems. This has resulted in a paradigm shift toward the development of medium- and high-voltage (MV/HV) SiC power modules to revolutionize the future power grid and transportation systems. However, designing MV/HV SiC power modules involves significant design challenges due to higher blocking voltage and exacerbation of side effects due to high switching dv/dt and di/dt of SiC devices concerns that may not be as critical as in LV module development. This article reviews the development of state-of-the-art MV/HV SiC power modules, ranging from 3.3 to 40 kV, from both industry and academia. First, a discussion on SiC modules based on voltage level is presented. This is followed by a discussion of challenges associated with designing and testing MV/HV modules - including parasitic controls, electromagnetic interference (EMI), partial discharge (PD), and thermal management - and the corresponding mitigation approaches from various perspectives. We conclude with a summary of major findings and future directions for the development of MV/HV modules.
| Original language | English |
|---|---|
| Pages (from-to) | 2177-2195 |
| Number of pages | 19 |
| Journal | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Volume | 14 |
| Issue number | 12 |
| DOIs | |
| State | Published - 2024 |
Keywords
- Electromagnetic interference (EMI)
- medium-/high-voltage (MV/HV) silicon carbide (SiC) power modules
- parasitics control
- partial discharge (PD)
- thermal management
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