Study of mm-sized Coil to Coil Backscatter Based Communication Link

Xiao Sha; Yasha Karimi; Samir R. Das; Petar Djuric; Milutin Stanacevic

doi:10.1109/UEMCON47517.2019.8992985

Study of mm-sized Coil to Coil Backscatter Based Communication Link

Xiao Sha
, Yasha Karimi
, Samir R. Das
, Petar Djuric
, Milutin Stanacevic

Stony Brook University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Distribution of a large number of mm-sized sensing units in brain is a vision for the next generation of implantable devices for neural recording. Recorded data from the implants is conventionally transferred to a central external device and the bandwidth of the uplink channel is limited by the number of the implanted units. For the first time, we demonstrate the feasibility of local communication between mm-sized coils using backscattering technique which promises to reduce the requirement on the uplink bandwidth between the external device and the implants. To demonstrate the feasibility of the proposed link, two implanted coils located at 14 mm implantation depth are used with the distance between coils of 1.5 mm. The transmitting coil switches between two terminating impedance and the input voltage at the receiving coil is observed in the simulations with a triple-loop inductive link designed at 90 MHz. We show that the voltage difference in the received signal for two transmitting states can be resolved by demodulator of the receiving implant demonstrating the link feasibility. Several simulations show the functionality of the link under wide range of different angular and lateral misalignment.

Original language	English
Title of host publication	2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019
Editors	Satyajit Chakrabarti, Himadri Nath Saha
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1124-1129
Number of pages	6
ISBN (Electronic)	9781728138855
DOIs	https://doi.org/10.1109/UEMCON47517.2019.8992985
State	Published - Oct 2019
Event	10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019 - New York City, United States Duration: Oct 10 2019 → Oct 12 2019

Publication series

Name	2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019

Conference

Conference	10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019
Country/Territory	United States
City	New York City
Period	10/10/19 → 10/12/19

Keywords

backscattered signal
implantable devices
inductive coupling
mm-sized coils
Wireless data communication

Access to Document

10.1109/UEMCON47517.2019.8992985

Cite this

Sha, X., Karimi, Y., Das, S. R., Djuric, P., & Stanacevic, M. (2019). Study of mm-sized Coil to Coil Backscatter Based Communication Link. In S. Chakrabarti, & H. N. Saha (Eds.), 2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019 (pp. 1124-1129). Article 8992985 (2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/UEMCON47517.2019.8992985

Sha, Xiao ; Karimi, Yasha ; Das, Samir R. et al. / Study of mm-sized Coil to Coil Backscatter Based Communication Link. 2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019. editor / Satyajit Chakrabarti ; Himadri Nath Saha. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 1124-1129 (2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019).

@inproceedings{74197267137d4c9e86c48d9703daaf5a,

title = "Study of mm-sized Coil to Coil Backscatter Based Communication Link",

abstract = "Distribution of a large number of mm-sized sensing units in brain is a vision for the next generation of implantable devices for neural recording. Recorded data from the implants is conventionally transferred to a central external device and the bandwidth of the uplink channel is limited by the number of the implanted units. For the first time, we demonstrate the feasibility of local communication between mm-sized coils using backscattering technique which promises to reduce the requirement on the uplink bandwidth between the external device and the implants. To demonstrate the feasibility of the proposed link, two implanted coils located at 14 mm implantation depth are used with the distance between coils of 1.5 mm. The transmitting coil switches between two terminating impedance and the input voltage at the receiving coil is observed in the simulations with a triple-loop inductive link designed at 90 MHz. We show that the voltage difference in the received signal for two transmitting states can be resolved by demodulator of the receiving implant demonstrating the link feasibility. Several simulations show the functionality of the link under wide range of different angular and lateral misalignment.",

keywords = "backscattered signal, implantable devices, inductive coupling, mm-sized coils, Wireless data communication",

author = "Xiao Sha and Yasha Karimi and Das, \{Samir R.\} and Petar Djuric and Milutin Stanacevic",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019 ; Conference date: 10-10-2019 Through 12-10-2019",

year = "2019",

month = oct,

doi = "10.1109/UEMCON47517.2019.8992985",

language = "English",

series = "2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019",

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Sha, X, Karimi, Y, Das, SR , Djuric, P & Stanacevic, M 2019, Study of mm-sized Coil to Coil Backscatter Based Communication Link. in S Chakrabarti & HN Saha (eds), 2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019., 8992985, 2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019, Institute of Electrical and Electronics Engineers Inc., pp. 1124-1129, 10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019, New York City, United States, 10/10/19. https://doi.org/10.1109/UEMCON47517.2019.8992985

Study of mm-sized Coil to Coil Backscatter Based Communication Link. / Sha, Xiao; Karimi, Yasha; Das, Samir R. et al.
2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019. ed. / Satyajit Chakrabarti; Himadri Nath Saha. Institute of Electrical and Electronics Engineers Inc., 2019. p. 1124-1129 8992985 (2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Study of mm-sized Coil to Coil Backscatter Based Communication Link

AU - Sha, Xiao

AU - Karimi, Yasha

AU - Das, Samir R.

AU - Djuric, Petar

AU - Stanacevic, Milutin

PY - 2019/10

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N2 - Distribution of a large number of mm-sized sensing units in brain is a vision for the next generation of implantable devices for neural recording. Recorded data from the implants is conventionally transferred to a central external device and the bandwidth of the uplink channel is limited by the number of the implanted units. For the first time, we demonstrate the feasibility of local communication between mm-sized coils using backscattering technique which promises to reduce the requirement on the uplink bandwidth between the external device and the implants. To demonstrate the feasibility of the proposed link, two implanted coils located at 14 mm implantation depth are used with the distance between coils of 1.5 mm. The transmitting coil switches between two terminating impedance and the input voltage at the receiving coil is observed in the simulations with a triple-loop inductive link designed at 90 MHz. We show that the voltage difference in the received signal for two transmitting states can be resolved by demodulator of the receiving implant demonstrating the link feasibility. Several simulations show the functionality of the link under wide range of different angular and lateral misalignment.

AB - Distribution of a large number of mm-sized sensing units in brain is a vision for the next generation of implantable devices for neural recording. Recorded data from the implants is conventionally transferred to a central external device and the bandwidth of the uplink channel is limited by the number of the implanted units. For the first time, we demonstrate the feasibility of local communication between mm-sized coils using backscattering technique which promises to reduce the requirement on the uplink bandwidth between the external device and the implants. To demonstrate the feasibility of the proposed link, two implanted coils located at 14 mm implantation depth are used with the distance between coils of 1.5 mm. The transmitting coil switches between two terminating impedance and the input voltage at the receiving coil is observed in the simulations with a triple-loop inductive link designed at 90 MHz. We show that the voltage difference in the received signal for two transmitting states can be resolved by demodulator of the receiving implant demonstrating the link feasibility. Several simulations show the functionality of the link under wide range of different angular and lateral misalignment.

KW - backscattered signal

KW - implantable devices

KW - inductive coupling

KW - mm-sized coils

KW - Wireless data communication

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M3 - Conference contribution

AN - SCOPUS:85081085339

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BT - 2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019

A2 - Chakrabarti, Satyajit

A2 - Saha, Himadri Nath

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 10th IEEE Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019

Y2 - 10 October 2019 through 12 October 2019

ER -

Sha X, Karimi Y, Das SR , Djuric P , Stanacevic M. Study of mm-sized Coil to Coil Backscatter Based Communication Link. In Chakrabarti S, Saha HN, editors, 2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 1124-1129. 8992985. (2019 IEEE 10th Annual Ubiquitous Computing, Electronics and Mobile Communication Conference, UEMCON 2019). doi: 10.1109/UEMCON47517.2019.8992985

Study of mm-sized Coil to Coil Backscatter Based Communication Link

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Keywords

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