The calculation of scalar transport during the injection molding of thermoset polymers

In this paper we present a numerical scheme for the calculation of the equation governing the advection of scalars such as temperature T and cure α during the injection mold filling of thermoset polymers. A finite-element line method is presented, with variations intended to cover a variety of processing conditions. Sample calculations are presented for the Garcia¹⁰ problem and the encapsulation of a Motorola computer chip. We also share our experience with some of the peculiar numerical difficulties associated with the simulation of injection molding for realistic systems. Some of these are related to mesh "quality," time step size selection, and (numerical) degeneracy that could result from some otherwise "physical" material models. The foregoing are issues that have not received a great deal of attention in the literature.