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The effect of aluminum nitride-silicon carbide alloy buffer layers on the sublimation growth of aluminum nitride on SiC (0001) substrates

  • Kansas State University
  • North Carolina State University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

The benefits of depositing AlN-SiC alloy transition layers on SiC substrates before the seeded growth of bulk AlN crystals were determined. The presence of the AlN-SiC alloy layer helped to suppress the SiC decomposition by providing vapor sources of silicon and carbon. It enabled a higher growth temperature, and hence a higher growth rate. In addition, cracks in the final AlN crystals can be decreased because of the intermediate lattice constants and thermal expansion coefficient of AlN-SiC alloy. AlN-SiC alloys were first grown on off-axis SiC substrates by the sublimation-recondensation method. Then pure AlN crystals were grown upon those. For comparison, AlN crystals were directly grown on SiC substrates under similar conditions. X-ray diffraction (XRD) confirmed the formation of a pure single crystalline AlN layer upon the AlN-SiC alloy on SiC substrate. The presence of an AlN-SiC transition layer effectively inhibited the appearance of cracks in the resultant AlN crystals. X-ray topography (XRT) demonstrated that the thick AlN layer effectively released the strain present.

Original languageEnglish
Title of host publicationSilicon Carbide and Related Materials - 2005, - Proceedings of the International Conference on Silicon Carbide and Related Materials -2005
PublisherTrans Tech Publications Ltd
Pages1497-1500
Number of pages4
EditionPART 2
ISBN (Print)9780878494255
DOIs
StatePublished - 2006
EventInternational Conference on Silicon Carbide and Related Materials 2005, (ICSCRM 2005) - Pittsburgh, PA, United States
Duration: Sep 18 2005Sep 23 2005

Publication series

NameMaterials Science Forum
NumberPART 2
Volume527-529
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Conference

ConferenceInternational Conference on Silicon Carbide and Related Materials 2005, (ICSCRM 2005)
Country/TerritoryUnited States
CityPittsburgh, PA
Period09/18/0509/23/05

Keywords

  • Alloy
  • Aluminum nitride
  • Buffer
  • Sublimation

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