Thermal spray techniques for fabrication of meso-electronics and sensors

S. Sampath; H. Herman; A. Patel; R. Gambino; R. Greenlaw; E. Tormey

doi:10.1557/PROC-624-181

Thermal spray techniques for fabrication of meso-electronics and sensors

S. Sampath
, H. Herman
, A. Patel
, R. Gambino
, R. Greenlaw
, E. Tormey

Materials Science and Engineering

Stony Brook University
Integrated Coating Solutions, Inc.
Sarnoff Corporation

Research output: Contribution to journal › Article › peer-review

20 Scopus citations

Abstract

Using both traditional and hybrid thermal spray methods, multilayer deposits of ceramics and metals having properties required by the electronics industry were produced. Significant values of resistivity were obtained for cold spray copper verses bulk values.

Original language	English
Pages (from-to)	181-188
Number of pages	8
Journal	Materials Research Society Symposium - Proceedings
Volume	624
DOIs	https://doi.org/10.1557/PROC-624-181
State	Published - 2000

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title = "Thermal spray techniques for fabrication of meso-electronics and sensors",

abstract = "Using both traditional and hybrid thermal spray methods, multilayer deposits of ceramics and metals having properties required by the electronics industry were produced. Significant values of resistivity were obtained for cold spray copper verses bulk values.",

author = "S. Sampath and H. Herman and A. Patel and R. Gambino and R. Greenlaw and E. Tormey",

year = "2000",

doi = "10.1557/PROC-624-181",

language = "English",

volume = "624",

pages = "181--188",

journal = "Materials Research Society Symposium - Proceedings",

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T1 - Thermal spray techniques for fabrication of meso-electronics and sensors

AU - Sampath, S.

AU - Herman, H.

AU - Patel, A.

AU - Gambino, R.

AU - Greenlaw, R.

AU - Tormey, E.

PY - 2000

Y1 - 2000

N2 - Using both traditional and hybrid thermal spray methods, multilayer deposits of ceramics and metals having properties required by the electronics industry were produced. Significant values of resistivity were obtained for cold spray copper verses bulk values.

AB - Using both traditional and hybrid thermal spray methods, multilayer deposits of ceramics and metals having properties required by the electronics industry were produced. Significant values of resistivity were obtained for cold spray copper verses bulk values.

UR - https://www.scopus.com/pages/publications/0034449095

U2 - 10.1557/PROC-624-181

DO - 10.1557/PROC-624-181

M3 - Article

AN - SCOPUS:0034449095

SN - 0272-9172

VL - 624

SP - 181

EP - 188

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

ER -

Thermal spray techniques for fabrication of meso-electronics and sensors

Abstract

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